Package Drawings*

QP Techologies’ (formerly Quik-Pak) Open-molded Plastic Packages (OmPP®) are pre-molded, air cavity quad flat no-lead (QFN) packages that provide a high quality, fast solution for your IC packaging and assembly needs. OmPPs come in a variety of sizes and are ideal for prototype, mid-volume, or production volume applications.

Our overmolded QFN line consists of a large selection of JEDEC-compliant plastic packages options to provide quick turn engineering builds, high mix/low volume assembly and onshore volume production. All QFNs are RoHS compliant and utilize NiPdAu plated lead frames. The versatile and cost effective QFN platform has become the package of choice for single die, multi-die, SiPs, stacked die, RF, and MEMS device packaging. We support custom designs in addition to the below standard offerings.

QP Technologies offers leaded plastic packages in a variety of sizes and types, ensuring your ability to continue using these solutions for a range of applications from prototype to full production. Options include mini small outline package (MSOP), plastic dual inline package (PDIP), quarter size outline package (QSOP), small outline integrated circuit (SOIC), shrink small outline package (SSOP) and thin SSOP (TSSOP).

Many packages can be altered for a custom fit and new designs may not be listed. Please contact the QP Technologies sales team to discuss your custom packaging requirements.

Please note: the following drawings are examples of packages offered and may not reflect the latest revisions. For most up-to-date drawings, please reach out to our sales team. We will be happy to assist and provide the latest versions.

Open-molded Plastic Package (OmPP®) Drawings