Advanced Semiconductor Assembly Services
Precision Assembly for Complex Semiconductor Structures
QP Technologies provides advanced semiconductor assembly services for prototype and low-volume production applications. Our assembly processes support a wide range of complex package types, multi-component architectures, and emerging high-performance device requirements.
Chip-on-Board (COB) & Chip-on-Flex (COF) Assembly
Our chip-on-board (COB) and chip-on-flex (COF) capabilities enable direct die placement and attachment onto rigid circuit boards and flexible substrates up to 5″ × 8″ and larger. Using automated die bonding and wire-bonding equipment, we can:
- Bond bare die to boards and flex
- Integrate passives and discretes
- Mount and protect devices with encapsulation, frames, or custom covers
- Develop custom fixtures for complex geometries
These capabilities support both prototype builds and higher-mix assemblies where flexibility and precision are critical.
Multi-Chip Module (MCM) & System-in-Package (SiP)
QP Technologies assembles multiple active and passive components into a single module or package using multi-chip module (MCM) and system-in-package (SiP) approaches. These architectures reduce form factor while delivering high-performance functionality.
We can assemble disparate die and discretes on shared substrates with process control optimized for:
- Signal integrity
- Thermal management
- Power distribution
- High component density
This is ideal for miniature and complex assemblies where space and performance are at a premium.
Flip Chip Assembly & Turnkey Integration
As devices transition to flip chip architectures, QP Technologies offers complete flip chip assembly services including:
- Wafer or die bumping
- Die placement
- Solder reflow
- Underfill application
- Encapsulation
- Substrate ball attach
We can also support substrate design and fabrication as part of a turnkey flip chip solution, reducing handoffs and cycle time for prototype and low-volume requirements.
Stacked Die Assembly
Stacked die solutions combine multiple die types, such as logic, memory, and specialty functions, into a single package footprint. QP Technologies’ stacked die process includes:
- Thin die handling enabled by precision backgrinding
- Die-to-die and die-to-substrate bonding
- Controlled wire bonding and interconnect placement
This assembly type is ideal for modern, space-constrained applications where performance density matters most.
Chiplet Integration
Chiplets are a modular approach to semiconductor design that allow pre-qualified die to be assembled into a unified package. QP Technologies supports chiplet integration strategies that:
- Accommodate heterogeneous die
- Support advanced compute, AI & HPC applications
- Enable improved yield with modular design
- Integrate high-speed, high-bandwidth interconnects
Our flexible assembly processes allow effective chiplet assembly on diverse substrates and package forms.
Surface Mount Technology (SMT)
Our surface mount technology (SMT) services attach a full range of passives, discrete components, and integrated circuits directly to printed circuit boards or flex circuits. SMT minimizes footprint while maintaining high electrical performance and reliability across:
- Passive networks
- Connectors
- Discrete components
- IC assemblies
Inventory Management & BOM Procurement
QP Technologies offers flexible inventory and materials management services, including:
- Consignment of materials
- Procurement of bill of materials (BOM)
- Turnkey program management
We tailor material handling and inventory strategies to meet procurement timelines and assembly schedule constraints.
Integration with Packaging & Wafer Services
Advanced assembly is part of QP Technologies’ broader suite of semiconductor services, which also include wafer preparation, IC packaging, design support, and engineering. This integrated approach ensures:
- Reduced handling risk
- Improved throughput
- Enhanced traceability
- Lower assembly lead times
Request Advanced Assembly Consultation
To evaluate your assembly requirements, including SiP, flip chip, stacked die, or chiplet integration, contact QP Technologies with your design files, BOM, and performance goals.