Plastic Overmolded QFN Open-tooled

A large selection of JEDEC-compliant plastic QFN packages are available to provide quick turn engineering builds, high mix/low volume assembly and onshore volume production. All QFNs are overmolded, are RoHS compliant and utilize NiPdAu plated lead frames. The versatile and cost effective QFN “platform” has become the package of choice for single die, multi-die, SiPs, stacked die, RF, and MEMS device packaging. QP Technologies (formerly Quik-Pak) supports custom designs in addition to the below standard offerings.

• Air Cavity QFN Open-molded Plastic Packages
• Ceramic IC Packages
• Custom Configurations

• BGA Substrates
• Open Cavity Plastic Packages
• Die Attach

• Wire Bonding
• Encapsulation Options
• Marking/Branding