News Archives | QP Technologies

QP Technologies™ Expands Interposer Design Capabilities

Leverages Substrate Design Services to Create Flexible, Low-Cost Packaging Solutions ESCONDIDO, Calif. – March 29, 2021 – QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced expanded capabilities related to interposer designs for flip-chip and large-cavity packaging as an extension of the company’s substrate design services announced last year.…

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Quik-Pak Becomes QP Technologies™

New brand reflects growing breadth of company’s technology and engineering capabilities ESCONDIDO, Calif., March 11, 2021 (GLOBE NEWSWIRE) -- Leading provider of microelectronic packaging and assembly solutions Quik-Pak today announced the business’s new name QP Technologies™. This change and the related rebranding are a natural outgrowth of the company’s evolution, including…

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Quik-Pak, Agile Microwave Technology and OMMIC Verify RF-Capable Packaging Solutions for 5G and IoT Semiconductor Devices

Collaboration Targets Packaging for Millimeter-Wave Applications Escondido, CA – October 6, 2020: Quik-Pak, together with Agile Microwave Technology (AgileMwT) and OMMIC SA, today announced its line of JEDEC-compliant air-cavity QFN packages. The Quik-Pak openmolded plastic packages (OmPP®) are RF-capable to data rates of 43GHz, which will help speed availability of…

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Quik-Pak Relocates to Larger, Customized Facility

New 20,000 SF Building Is Operational and Supporting Essential Businesses Escondido, CA – April 7, 2020: Quik-Pak, a provider of innovative microelectronic packages, assembly and wafer-processing solutions, today announced it has relocated all operations to its new facility at 2063 Wineridge Place in Escondido. Download Press Release

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Quik-Pak Announces Substrate Development Service

San Diego, CA - February 11, 2020: Quik-Pak, a provider of innovative microelectronic packaging and assembly solutions, today announced its substrate design, fabrication and assembly service. Utilizing virtually any substrate type, Quik-Pak can create turnkey solutions for substrate-based assemblies to accommodate customers’ unique packaging requirements, with delivery times at least…

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Quik-Pak Acquires Wafer-Preparation Firm QBBS

San Diego, CA - November 25, 2019: Quik-Pak gains volume capacity for wafer backgrinding to accommodate growing market demands. Download Press Release

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Quik-Pak Names Ken Molitor Chief Operating Officer

San Diego, CA - July 17, 2019: Quik-Pak, a division of Promex Industries, has named Ken Molitor Chief Operating Officer. In this new position, Molitor will be responsible for all operations at the San Diego facility, including executing the current strategy to grow the business, monitoring financial performance, expanding production…

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Promex Quik-Pak Return to IEEE Long Island RF/Microwave Symposium with Quick-Turn Air Cavity QFNs for Microwave, Millimeter Wave and RF Applications

Promex and its Quik-Pak Division return to the IEEE Long Island RF/Microwave Symposium, the area’s premier annual event for engineers, managers and technical professionals in the microwave, millimeter wave and RF community. Download Flyer

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Promex and Quik-Pak Employees Donate Truckloads of Gifts to Toys R Tots

Santa Clara, CA – December 21, 2018: Promex and Quik-Pak joined tens of thousands of volunteers working with 800 community action programs across the US, in Puerto Rico and the Virgin Islands to donate toys to less fortunate children. Download Press Release

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Promex Quik-Pak Features Air Cavity Plastic and Overmolded QFNs at Electronic Packaging Symposium, September 18-19, Binghamton, New York

Santa Clara, CA – August 27, 2018: The Quik-Pak Division of Promex will exhibit air cavity plastic QFNs and overmolded QFNs at the 30th Annual Electronics Packaging Symposium (EPS), September 18 - 19, 2018 in Binghamton, New York. Download Press Release

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Promex Quik-Pak Exhibits Air Cavity Plastic and Overmolded QFNs in Booth 809 at IEEE MTT International Microwave Symposium (IMS) June 10 – 15

San Diego, CA – June 8, 2018: Quik-Pak, a division of Promex providing innovative microelectronic packaging and assembly solutions for complex devices, will exhibit Air Cavity Plastic and Overmolded QFN Packages for RF/microwave, MEMS and sensor applications in Booth 809 at the IEEE MTT International Microwave Symposium (IMS), June 10-15,…

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Quik-Pak, Promex Upcoming Tradeshows

San Diego, CA – May 25, 2018: ECTC, May 29 - June 1, 2018, Booth #408 / IMS, June 12 - June 14, 2018, Booth #809 / Sensors Expo & Conference, June 26 - June 28, 2018, Booth #1526.

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