May 2023 Newsletter
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QP Technologies™ Broadens Microelectronics Plastic-Package Portfolio
New TQFP and MQFP Offerings Increase Packaging Options for Mil-Aero, Automotive and Other Key Markets ESCONDIDO, Calif. – March 16, 2023 – QP Technologies™, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has extended its broad plastic package assembly portfolio with two new offerings: a 64-pin thin quad flat pack…
QP Technologies™ Boosts Process Capabilities, Expands Team to Target New and Growing Markets
Improvements Designed to Meet Escalating Demand for Packaging and Assembly Expertise BOSTON, Oct. 03, 2022 - QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced it is expanding its process capabilities in response to rising customer demand for its offerings, which also include wafer preparation…
QP Technologies Partners with AnySilicon
QP-Technologies-Partners-with-AnySilicon
QP Technologies™ Sees Double-Digit Growth, Expands Team and Offerings to Meet Customer Needs
Demand for Packaging and Assembly Expertise Continues to Escalate ESCONDIDO, Calif. – Sept. 29, 2021 – QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, has added multiple new positions and capabilities to accommodate rising customer requirements. The company emerged from the global pandemic stronger…
QP Technologies™ Installs New Wire Bonders, Broadening Reach in Mil-Aero, RF, Power Markets
Hesse Fine and Heavy Wire Bonders Enable Fully Automated Processing of Assembly Projects QP Technologies can create secure aluminum wedge bonds, like those shown in this microscopic image, for RF, power and mil-aero devices using its Hesse Mechatronics bonders. ESCONDIDO, Calif. – August 16, 2021 – QP Technologies™ (formerly Quik-Pak),…
Industry Veteran Rosie Medina Appointed as VP of Sales and Marketing for Promex Industries, Inc. Divisions
Medina to lead sales and marketing activities for the company’s Promex Medical and Biotech and QP Technologies Entities SANTA CLARA, Calif. – July 20, 2021 – Promex Industries, a biotech microelectronics manufacturer specializing in heterogeneous integration of key subsystems for medical, diagnostic, and life sciences devices, announced that industry veteran and…
QP Technologies™ Expands Interposer Design Capabilities
Leverages Substrate Design Services to Create Flexible, Low-Cost Packaging Solutions ESCONDIDO, Calif. – March 29, 2021 – QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced expanded capabilities related to interposer designs for flip-chip and large-cavity packaging as an extension of the company’s substrate design services announced last year.…
Quik-Pak Becomes QP Technologies™
New brand reflects growing breadth of company’s technology and engineering capabilities ESCONDIDO, Calif., March 11, 2021 (GLOBE NEWSWIRE) -- Leading provider of microelectronic packaging and assembly solutions Quik-Pak today announced the business’s new name QP Technologies™. This change and the related rebranding are a natural outgrowth of the company’s evolution, including…
Quik-Pak, Agile Microwave Technology and OMMIC Verify RF-Capable Packaging Solutions for 5G and IoT Semiconductor Devices
Collaboration Targets Packaging for Millimeter-Wave Applications Escondido, CA – October 6, 2020: Quik-Pak, together with Agile Microwave Technology (AgileMwT) and OMMIC SA, today announced its line of JEDEC-compliant air-cavity QFN packages. The Quik-Pak openmolded plastic packages (OmPP®) are RF-capable to data rates of 43GHz, which will help speed availability of…
Quik-Pak Relocates to Larger, Customized Facility
New 20,000 SF Building Is Operational and Supporting Essential Businesses Escondido, CA – April 7, 2020: Quik-Pak, a provider of innovative microelectronic packages, assembly and wafer-processing solutions, today announced it has relocated all operations to its new facility at 2063 Wineridge Place in Escondido. Download Press Release
Quik-Pak Announces Substrate Development Service
San Diego, CA - February 11, 2020: Quik-Pak, a provider of innovative microelectronic packaging and assembly solutions, today announced its substrate design, fabrication and assembly service. Utilizing virtually any substrate type, Quik-Pak can create turnkey solutions for substrate-based assemblies to accommodate customers’ unique packaging requirements, with delivery times at least…