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Leverages Substrate Design Services to Create Flexible, Low-Cost Packaging Solutions ESCONDIDO, Calif. – March 29, 2021 – QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced expanded capabilities related to interposer designs for flip-chip and large-cavity packaging as an extension of the company’s substrate design services announced last year.…

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San Diego, CA - February 11, 2020: Quik-Pak, a provider of innovative microelectronic packaging and assembly solutions, today announced its substrate design, fabrication and assembly service. Utilizing virtually any substrate type, Quik-Pak can create turnkey solutions for substrate-based assemblies to accommodate customers’ unique packaging requirements, with delivery times at least…

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San Diego, CA - November 25, 2019: Quik-Pak gains volume capacity for wafer backgrinding to accommodate growing market demands. Download Press Release

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San Diego, CA - July 17, 2019: Quik-Pak, a division of Promex Industries, has named Ken Molitor Chief Operating Officer. In this new position, Molitor will be responsible for all operations at the San Diego facility, including executing the current strategy to grow the business, monitoring financial performance, expanding production…

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Promex and its Quik-Pak Division return to the IEEE Long Island RF/Microwave Symposium, the area’s premier annual event for engineers, managers and technical professionals in the microwave, millimeter wave and RF community. Download Flyer

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Santa Clara, CA – December 21, 2018: Promex and Quik-Pak joined tens of thousands of volunteers working with 800 community action programs across the US, in Puerto Rico and the Virgin Islands to donate toys to less fortunate children. Download Press Release

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Santa Clara, CA – August 27, 2018: The Quik-Pak Division of Promex will exhibit air cavity plastic QFNs and overmolded QFNs at the 30th Annual Electronics Packaging Symposium (EPS), September 18 - 19, 2018 in Binghamton, New York. Download Press Release

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San Diego, CA – June 8, 2018: Quik-Pak, a division of Promex providing innovative microelectronic packaging and assembly solutions for complex devices, will exhibit Air Cavity Plastic and Overmolded QFN Packages for RF/microwave, MEMS and sensor applications in Booth 809 at the IEEE MTT International Microwave Symposium (IMS), June 10-15,…

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San Diego, CA – May 25, 2018: ECTC, May 29 - June 1, 2018, Booth #408 / IMS, June 12 - June 14, 2018, Booth #809 / Sensors Expo & Conference, June 26 - June 28, 2018, Booth #1526.

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