News

Promex Industries and QP Technologies Appoint David Fromm President and Chief Operating Officer 

Experienced Technology Leader to Drive Innovation and Guide Next Chapter of Operational Growth for Pioneering Microelectronics Assembly Organizations  SANTA CLARA and ESCONDIDO, Calif. — April 29, 2026 — Promex Industries and its QP Technologies division today announced the appointment of David Fromm as president and chief operating officer of both organizations, effective immediately.   Fromm brings deep expertise in advanced instrumentation, process development, and technology leadership to his expanded role. Since joining Promex, he has been instrumental in developing specialized manufacturing processes for complex microelectronics assemblies, earning the trust of both […]

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Lead Frames: The Unsung Backbone of Modern Semiconductor Packaging

When you think about semiconductor innovation, advanced nodes, novel materials, or sophisticated system architectures are what typically come to mind. Packaging is often viewed as a final step – a mere protective shell around the “real” technology, but for today’s devices, the package is key to device performance, reliability and […]

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Promex Industries and QP Technologies Implement Sales/Marketing Reorganization, Promoting Rosie Medina to Promex Senior Vice President and Matt Hansen to QP Technologies Vice President

Two companies heightening focus on individual core competencies to better pursue rapidly expanding business opportunities. SANTA CLARA, Calif., July 29, 2024 – Promex Industries, a Silicon Valley-based provider of advanced design, packaging and microelectronics assembly services, and its San Diego-based division QP Technologies, a leading provider of innovative microelectronic packaging and assembly […]

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QP Technologies™ Expands Die Preparation Business

Adds Fully Automated Dicing Saw to Equipment Line, Enabling Even Greater Precision, Throughput for Die Singulation ESCONDIDO, Calif. – June 19, 2024 – QP Technologies™, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has added a state-of-the-art dicing saw to its manufacturing line, expanding its […]

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QP Technologies™ Achieves ANSI/ESD S20.20 Certification

Certification and Ongoing Monitoring Assures Customers of Manufacturing Operations’ ESD Control and Safety ESCONDIDO, Calif. – April 11, 2024 – QP Technologies™, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has been certified ANSI/ESD S20.20-compliant by TÜV SÜD America Inc. – one of only six […]

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QP Technologies™ Achieves ISO Certifications from Global Auditing and Certification Body TÜV SÜD America Inc.

ESCONDIDO, Calif., Nov. 28, 2023 (GLOBE NEWSWIRE) — QP Technologies™, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has achieved ISO 9001:2015 and ISO 13485:2016 certifications from globally recognized standards auditing and certification body TÜV SÜD America Inc. (TÜV SÜD). Developed and published by the International […]

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ECTC 2023: 3D InCites Podcast

Listen to 3D InCites recently published CHIPS Act podcast from ECTC 2023. Our CEO, Dick Otte, is featured at 13:55 in which he discusses the impact of the CHIPS Act and his key takeaways from ECTC’s special discussion panel on the act itself.

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ECTC 2023: Chips ACT Implications Presentation – Dick Otte, CEO

This brief presentation was the third given at the start of the “Special Session on the CHIPS Act Implications” at ECTC 2023 in Orlando Florida. The two proceeding talks were by Carl McCants, DARPA and Robert Rudnitsky, NIST. Other panelists were; Hern Takiar, Micron; Joshua Dillon, Marvell; Subramanian Iyer, UCLA.  The […]

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QP Technologies™ Broadens Microelectronics Plastic-Package Portfolio

New TQFP and MQFP Offerings Increase Packaging Options for Mil-Aero, Automotive and Other Key Markets ESCONDIDO, Calif. – March 16, 2023 – QP Technologies™, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has extended its broad plastic package assembly portfolio with two new offerings: a 64-pin thin quad flat pack […]

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QP Technologies Partners with AnySilicon

AnySilicon, the leading marketplace for semiconductor service providers, announced today that QP Technologies, a worldwide leader in packaging and assembly services, has partnered with AnySilicon to promote its IC packaging and assembly services. As part of the AnySilicon platform, QP Technologies will gain access to a full range of online marketing services to showcase its offering, increase exposure and generate leads.

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