Listen to 3D InCites recently published podcast from ECTC 2023. Our CEO, Dick Otte, is featured at 13:55 in which he discusses the impact of the CHIPS Act and his key takeaways from ECTC’s special discussion panel on the act itself.
This brief presentation was the third given at the start of the “Special Session on the CHIPS Act” at ECTC 2023 in Orlando Florida. The two proceeding talks were by Carl McCants, DARPA and Robert Rudnitsky, NIST. Other panelists were; Hern Takiar, Micron; Joshua Dillon, Marvell; Subramanian Iyer, UCLA. The moderators […]
New TQFP and MQFP Offerings Increase Packaging Options for Mil-Aero, Automotive and Other Key Markets ESCONDIDO, Calif. – March 16, 2023 – QP Technologies™, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has extended its broad plastic package assembly portfolio with two new offerings: a 64-pin thin quad flat pack […]
Improvements Designed to Meet Escalating Demand for Packaging and Assembly Expertise BOSTON, Oct. 03, 2022 – QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced it is expanding its process capabilities in response to rising customer demand for its offerings, which also include wafer preparation […]
AnySilicon, the leading marketplace for semiconductor service providers, announced today that QP Technologies, a worldwide leader in packaging and assembly services, has partnered with AnySilicon to promote its IC packaging and assembly services. As part of the AnySilicon platform, QP Technologies will gain access to a full range of online marketing services to showcase its offering, increase exposure and generate leads.
Demand for Packaging and Assembly Expertise Continues to Escalate ESCONDIDO, Calif. – Sept. 29, 2021 – QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, has added multiple new positions and capabilities to accommodate rising customer requirements. The company emerged from the global pandemic stronger […]
Hesse Fine and Heavy Wire Bonders Enable Fully Automated Processing of Assembly Projects ESCONDIDO, Calif. – August 16, 2021 – QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has installed two new Hesse Mechatronics ultrasonic wire bonders at its wholly owned […]
Industry Veteran Rosie Medina Appointed as VP of Sales and Marketing for Promex Industries, Inc. Divisions
Medina to lead sales and marketing activities for the company’s Promex Medical and Biotech and QP Technologies Entities SANTA CLARA, Calif. – July 20, 2021 – Promex Industries, a biotech microelectronics manufacturer specializing in heterogeneous integration of key subsystems for medical, diagnostic, and life sciences devices, announced that industry veteran and […]
Leverages Substrate Design Services to Create Flexible, Low-Cost Packaging Solutions ESCONDIDO, Calif. – March 29, 2021 – QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced expanded capabilities related to interposer designs for flip-chip and large-cavity packaging as an extension of the company’s substrate design services announced last year. […]
New brand reflects growing breadth of company’s technology and engineering capabilities ESCONDIDO, Calif., March 11, 2021 (GLOBE NEWSWIRE) — Leading provider of microelectronic packaging and assembly solutions Quik-Pak today announced the business’s new name QP Technologies™. This change and the related rebranding are a natural outgrowth of the company’s evolution, including […]
Quik-Pak, Agile Microwave Technology and OMMIC Verify RF-Capable Packaging Solutions for 5G and IoT Semiconductor Devices
Collaboration Targets Packaging for Millimeter-Wave Applications Escondido, CA – October 6, 2020: Quik-Pak, together with Agile Microwave Technology (AgileMwT) and OMMIC SA, today announced its line of JEDEC-compliant air-cavity QFN packages. The Quik-Pak openmolded plastic packages (OmPP®) are RF-capable to data rates of 43GHz, which will help speed availability of […]
New 20,000 SF Building Is Operational and Supporting Essential Businesses Escondido, CA – April 7, 2020: Quik-Pak, a provider of innovative microelectronic packages, assembly and wafer-processing solutions, today announced it has relocated all operations to its new facility at 2063 Wineridge Place in Escondido. Download Press Release