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Hesse Fine and Heavy Wire Bonders Enable Fully Automated Processing of Assembly Projects QP Technologies can create secure aluminum wedge bonds, like those shown in this microscopic image, for RF, power and mil-aero devices using its Hesse Mechatronics bonders. ESCONDIDO, Calif. – August 16, 2021 – QP Technologies™ (formerly Quik-Pak),…

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Medina to lead sales and marketing activities for the company’s Promex Medical and Biotech and QP Technologies Entities SANTA CLARA, Calif. – July 20, 2021 – Promex Industries, a biotech microelectronics manufacturer specializing in heterogeneous integration of key subsystems for medical, diagnostic, and life sciences devices, announced that industry veteran and…

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Leverages Substrate Design Services to Create Flexible, Low-Cost Packaging Solutions ESCONDIDO, Calif. – March 29, 2021 – QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced expanded capabilities related to interposer designs for flip-chip and large-cavity packaging as an extension of the company’s substrate design services announced last year.…

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New brand reflects growing breadth of company’s technology and engineering capabilities ESCONDIDO, Calif., March 11, 2021 (GLOBE NEWSWIRE) -- Leading provider of microelectronic packaging and assembly solutions Quik-Pak today announced the business’s new name QP Technologies™. This change and the related rebranding are a natural outgrowth of the company’s evolution, including…

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Collaboration Targets Packaging for Millimeter-Wave Applications Escondido, CA – October 6, 2020: Quik-Pak, together with Agile Microwave Technology (AgileMwT) and OMMIC SA, today announced its line of JEDEC-compliant air-cavity QFN packages. The Quik-Pak openmolded plastic packages (OmPP®) are RF-capable to data rates of 43GHz, which will help speed availability of…

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