QP Technologies™ Boosts Process Capabilities, Expands Team to Target New and Growing Markets
Improvements Designed to Meet Escalating Demand for Packaging and Assembly Expertise BOSTON, Oct. 03, 2022 - QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced it is expanding its process capabilities in response to rising customer demand for its offerings, which also include wafer preparation…