Precision Wafer Backgrinding & Dicing Services
Ultra-Thin Wafer Backgrinding Capabilities
To meet the requirements of today’s ultra-thin semiconductor packages, QP Technologies grinds wafers down to thicknesses as low as 50 µm. Our process utilizes state-of-the-art automatic surface grinders combined with DISCO Poligrind™ technology.
DISCO’s Poligrind wheel technology:
- Reduces surface roughness
- Improves die mechanical strength
- Minimizes wafer warpage
- Enhances overall yield performance
Our wafer backgrinding services support wafers up to 300 mm in diameter, as well as:
- Partial wafers
- Bumped wafers
- Individual die
Controlled grinding parameters are configured based on wafer material, starting thickness, and final device requirements to ensure tight Total Thickness Variation (TTV) and structural stability.
Thickness Control & Stress Management
Achieving ultra-thin wafer profiles requires careful control of mechanical stress and subsurface damage. QP Technologies employs:
- Multi-stage grinding sequences
- Progressive grit reduction
- Controlled feed rates and spindle speeds
- Coolant flow optimization
- Surface conditioning for downstream processes
These measures reduce microcracking and preserve die integrity for high-performance and high-reliability applications.
Advanced Wafer Dicing Capabilities
QP Technologies provides precision wafer dicing services utilizing state-of-the-art DISCO precision dicing saws. We support:
- Silicon Carbide (SiC) wafers
- GaN-on-Silicon wafers
- Standard silicon wafers
- Wafers up to 300 mm
We accommodate:
- Multi-project wafers (MPW)
- Pizza wafers
- Reticles
- Partial wafers
- Bumped wafers
Our team can isolate only the required die by sacrificing unused sections, or remount wafer pieces to perform intricate dicing maneuvers that preserve maximum usable die from each reticle.
In addition to semiconductor wafers, we also dice substrates and panels made from:
- Laminates
- Ceramic
- Glass
- Quartz
Silicon Carbide (SiC) Dicing Expertise
Silicon Carbide (SiC) semiconductors operate at significantly higher temperatures, voltages, and power levels compared to traditional silicon devices. These advantages enable smaller, lighter, and more efficient electrical systems.
However, SiC is an extremely difficult material to dice and requires specialized parameters and process control.
QP Technologies utilizes the latest DISCO dicing technology to efficiently process SiC wafers, applying optimized blade selection, feed rates, and cutting strategies to minimize chipping and maximize die yield.
Kerf Optimization & Yield Protection
Wafer dicing directly impacts die yield and structural integrity. Our dicing process emphasizes:
- Kerf width optimization
- Alignment verification
- Reduced edge chipping
- Mechanical shock minimization
- Debris management and cleaning
Each process is tuned according to wafer thickness, substrate material, and final packaging requirements.
Post-Dicing Sorting & Handling
Following wafer dicing, QP Technologies offers multiple die handling options:
- Sorting via wafer map or ink dot identification
- Placement into Gel-Paks
- Waffle packs
- Chip trays
- Or retention on dicing tape for future assembly
Handling protocols are designed to protect fragile ultra-thin die and preserve traceability.
Materials & Wafer Types Supported
- Silicon wafers
- Silicon Carbide (SiC)
- GaN-on-Silicon
- Compound semiconductor substrates
- Laminates
- Ceramic
- Glass
- Quartz
Process parameters are customized based on substrate characteristics and downstream integration requirements.
Engineering Collaboration
QP Technologies works directly with customer engineering teams to define:
- Target final wafer thickness
- Acceptable TTV ranges
- Die strength requirements
- Kerf specifications
- Material-specific dicing strategies
Early collaboration ensures backgrinding and singulation parameters align with reliability, thermal, and packaging integration goals.
Request Technical Consultation
To discuss wafer backgrinding, SiC dicing, or ultra-thin wafer processing requirements, contact QP Technologies with your wafer diameter, material type, and target specifications.