Surface mount technology has allowed electronic devices to get smaller with continually shrinking footprints. In SMT, all the different components (passives, diodes, transistors, connectors, and integrated circuits) needed for today’s devices are attached to the surface of the printed circuit board or flex circuit, oftentimes right alongside the bare die. 

QP Technologies (formerly Quik-Pak) can manage the populating of your boards for prototyping or production volumes for one-stop-shop assembly services.