U.S. Chip Packaging
with Mil-Spec Precision

QP Technologies is your reliable IC packaging partner to build the future of mil-aero applications through Open-Cavity Plastic Packages (OCPP).

Download our white paper to learn:

  • How you can transform your plastic package dummies, test rejects, and excess inventory into ready-to-assemble components
  • The value of an onshore solution for navigating around ITAR supply constraints
  • The benefits from producing chip prototypes that are mechanically and electrically identical to future molded production parts
  • Why Open-Cavity Plastic Packages’ (OCPP) longevity and durability specs make them an ideal solution for mil-aero machinery

The white paper details a real-world use case where dummy IC packages converted to Open-Cavity Plastic Packages (OCPP) passed stringent burn-in and MSL tests just like factory-fresh parts. 

Download today to start unlocking the possibilities for your next IC packaging project.

Download our white paper now!

Managing MIL-STD-883 IC Compliance

Ready to qualify your mil-aero electronic devices? We can help manage your Method 5004 process flow.

We’re at booth 113 at iMAPS Boston

October 4 – 6, 2022, at the Hynes Convention Center in Boston, MA. Don’t miss us – set up a meeting now!