Design & Engineering
Design & Engineering Services
End-to-end engineering support to accelerate development, improve manufacturability, and reduce time to market. Our team works closely with customers to transform concepts into production-ready solutions for high-reliability applications.
Design & Engineering Capabilities
From initial concept through production, our design and engineering services are fully integrated with our manufacturing processes. This ensures seamless transitions, optimized performance, and faster development cycles.
Custom Package Design
We design and develop custom semiconductor packaging solutions tailored to specific performance, size, and environmental requirements.
Capabilities include:
- QFN, BGA, OmPP, and leaded package design
- Flip chip and advanced packaging architectures
- Substrate-based and chip-scale packaging solutions
- Hermetic and non-hermetic package development
Substrate & Interconnect Design
Our engineering team develops optimized substrate layouts and interconnect structures to meet demanding electrical, thermal, and mechanical requirements.
Capabilities include:
- Substrate design and layout
- Signal integrity and routing optimization
- Thermal and mechanical considerations
- Wire bond and interconnect diagram development
Design for Manufacturability (DFM)
We ensure designs are optimized for production from the start, reducing risk, improving yields, and accelerating time to market.
Capabilities include:
- DFM analysis and review
- Process and materials selection
- Assembly flow optimization
- Yield and reliability considerations
Rapid Prototyping Support
Accelerate development with fast-turn prototype builds and iterative engineering support.
Capabilities include:
- Quick-turn prototype packaging
- Design iteration and refinement
- Engineering support for fabless companies
- Transition from prototype to production
Integrated with Full Manufacturing Flow
Our design and engineering services are tightly aligned with our in-house manufacturing capabilities, including wafer preparation, assembly, and final packaging. This integrated approach minimizes handoffs, reduces development time, and ensures consistency from concept through production.
Applications Supported
We support a wide range of high-performance and high-reliability industries, including:
- Aerospace & Defense
- Medical Devices
- Industrial and Commercial Electronics
- Advanced Semiconductor Packaging
Why QP Technologies
- End-to-end design and manufacturing capabilities
- Expertise in high-reliability applications
- Accelerated development timelines
- Flexible engagement models tailored to customer needs
Request Design & Engineering Support
Ready to move from concept to production? Partner with our engineering team to develop a solution tailored to your application.
Request a Quote