BGA Substrates

If your design project calls for the development of a custom BGA, interposer or other laminate substrate along with assembly services, QP Technologies (formerly Quik-Pak) is the answer.

We will coordinate the design and fabrication of your substrate, attach your die with wirebond or flip chip interconnects, encapsulate, mark and attach the solder spheres (ball attach).

QP Technologies is the solution for all of your laminate substrate assembly needs. If you have substrates, we can deliver the assembly services to complete your devices in as little as 8 hours.