Join Us For Our Spring Open House!

We are very excited to welcome the electronics community for the first-ever public tours of our new facility! Join us to tour the facility, meet with our engineering and sales teams and explore the full range of our product and service offerings!

The event will feature locally sourced food and beverage options including local San Diego craft beers. We will also host a raffle with many great prizes – including Zero Premium Charge on your next quick turn build (up to $3500 value)!

Other Prizes Include:

  • Samsung Galaxy Watch 5
  • Samsung Galaxy Tablet
  • JBL Bluetooth Speaker
  • Tumi Backpack

Complete the RSVP form to reserve your spot today!


  • LOCATION: QP Technologies, 2063 Wineridge Pl, Escondido, CA 92029
  • SHUTTLE DETAILS: Pick-up at GOMACTech 2023 (Town and Country San Diego) 4:30PM | Drop off at GOMACTech 2023 (Town and Country San Diego) 7:30PM
  • DATE: March 22, 2023 (after the GOMACTech Conference)
  • TIME: 5:30PM – 7:30PM



QP Technologies (formerly Quik-Pak), a division of Promex Industries, is based in Escondido, Calif. We are leaders in microelectronic packaging, assembly, wafer processing, substrate design, and other related services. Our 20,000-square-foot facility is ISO 9001:2015 and ISO-13485:2016 certified, and ITAR registered. These certifications are important to ensure we meet your requirements for quality, regardless of the market(s) that you are working in.

Our over-molded QFN/DFN packages and pre-molded air-cavity QFN packages (OmPP) offer a fast, convenient solution for your needs, ranging from prototype to volume production. We offer same-day assembly services that reduce your time to market, while our advanced assembly services can accommodate such structures as flip chip, stacked die, SiP, chiplets, MCM and COB.

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