News & Blog
Open-Cavity Plastic Packages: A Practical Approach to IC Prototyping
Developing a new IC involves more than designing and fabricating the die. At some point, the device needs to be assembled into a package so engineers can begin electrical testing, characterization, and system-level evaluation. For early-stage prototypes, time can become a packaging constraint of its own. Waiting for new package […]
June 2026 Newsletter
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Packaging: The Make-or-Break Factor in mmWave Performance
Millimeter-wave (mmWave) technology occupies the short-range, high-frequency portion of the electromagnetic spectrum—typically defined as 30 to 300 GHz—and is enabling a new generation of ultra-fast, high-capacity wireless communication and high-resolution sensing. From 5G and emerging 6G networks to satellite communications and advanced military and aerospace systems, mmWave devices are central […]
Promex Industries and QP Technologies Appoint David Fromm President and Chief Operating Officer
Experienced Technology Leader to Drive Innovation and Guide Next Chapter of Operational Growth for Pioneering Microelectronics Assembly Organizations. SANTA CLARA and ESCONDIDO, Calif. — April 30, 2026 — Promex Industries and its QP Technologies division today announced the appointment of David Fromm as president and chief operating officer of both organizations, effective immediately. Fromm brings deep expertise in advanced instrumentation, process development, and technology leadership to his expanded role. Since joining Promex, he has been […]
February 2026 Newsletter
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Lead Frames: The Unsung Backbone of Modern Semiconductor Packaging
When you think about semiconductor innovation, advanced nodes, novel materials, or sophisticated system architectures are what typically come to mind. Packaging is often viewed as a final step – a mere protective shell around the “real” technology, but for today’s devices, the package is key to device performance, reliability and […]