News & Blog
QP Technologies™ Expands Interposer Design Capabilities
Leverages Substrate Design Services to Create Flexible, Low-Cost Packaging Solutions ESCONDIDO, Calif. – March 29, 2021 – QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced expanded capabilities related to interposer designs for flip-chip and large-cavity packaging as an extension of the company’s substrate design services announced last year.…
COVID-19 UPDATE: QP Technologies Remains Open for Business
Per the state of California’s order, QP Technologies (formerly Quik-Pak) is considered an Essential Business as we service the telecommunication, biotech/healthcare, mil-aero, and general technology sectors and we are therefore exempt from this order. QP Technologies remains open for business and will continue to serve the needs of our valued…
Quik-Pak Becomes QP Technologies™
New brand reflects growing breadth of company’s technology and engineering capabilities ESCONDIDO, Calif., March 11, 2021 (GLOBE NEWSWIRE) — Leading provider of microelectronic packaging and assembly solutions Quik-Pak today announced the business’s new name QP Technologies™. This change and the related rebranding are a natural outgrowth of the company’s evolution, including…
New Year, New Name, More Capabilities
By Ken Molitor, Chief Operating Officer, QP Technologies A new year always brings the promise of a fresh start, a chance to reset, reinvigorate and perhaps refocus goals and objectives. This may never have been truer than when 2021 arrived. In February 2020, we moved our operations into our new,…
Quik-Pak Attains ISO 9001:2000 Certification
San Diego, CA, March 28, 2008: Quik-Pak, a division of Delphon Industries, announced today that it has met the strict requirements for ISO compliance and has been awarded ISO 9001:2000 certification for its IC packaging, assembly and prototyping services. Download Press Release
GSA Suppliers Expo Provides Optimal Opportunity for the Semiconductor Industry to View Innovative Solutions from Quik-Pak
San Diego, CA, September 1, 2008: Quik-Pak, a division of Delphon Industries, announced today that it will exhibit at the upcoming GSA Suppliers Expo October 2, 2008. The company plans on showing conference attendees its full turnkey solutions for their IC packaging and prototyping needs. Download Press Release
Quik-Pak Acquires Flip Chip Assembly, Radiation Sensor and Laser Micromachining Business Units of Aguila Technologies
San Diego, CA, September 25, 2008: Quik-Pak, a division of Delphon Industries, announced today the acquisition of Aguila Technologies’ flip chip assembly, detector array processing, and laser micromachining business units. The acquisition is part of Quik-Pak’s ongoing effort to expand its advanced packaging and assembly services. Download Press Release
Quik-Pak Launches New Website
San Diego, CA, February 2, 2009: Quik-Pak, a division of Delphon Industries and leading provider of custom IC Assembly, Wafer Backgrinding and Dicing, and patented Open Cavity Package services announced the launch of its new website today. The site was developed to more effectively deliver technical information regarding the company’s increased…
Quik-Pak Completes New Expansion
San Diego, CA, April 16, 2009: Quik-Pak, a division of Delphon Industries and leader in quick-turn integrated circuit (IC) prototype packaging, wafer processing, and advanced assembly services announced the completion of its new expanded facility today. The company has added 5,800 sq ft of new clean manufacturing space which houses advanced…
Quik-Pak Announces ITAR Registration
San Diego, CA, August 25, 2009: Quik-Pak, a division of Delphon Industries and leader in quick-turn integrated circuit (IC) prototype packaging, wafer processing, and advanced assembly services announced today that they have received their official International Traffic in Arms Regulations (ITAR) registration from the US Department of State, Bureau of Political-Military…
Chip Scale Review: CZT Detectors: Converging Assembly Technologies Open Application Opportunities
November 2009: Infrastructure Advisor’s Ron Lecke and Quik-Pak’s Howard Lenos discuss the latest in CZT Detector Assembly. Read the Article
Semiconductor Packaging News
January 12, 2010: Jeanne Beacham, Delphon CEO, discusses her outlook on 2010 in Semiconductor Packaging News Viewpoint Article. Read the Article