iMAPS Symposium offers one of the most robust programs for microelectronics and advanced packaging technical content. This year will focus on on Advanced Package Structures (Heterogeneous Integration, HPC, AI); Advanced Interconnect, Bumping & Bonding Technologies; High Reliability, RF/MW, MEMS/Sensors/Flexible, WLCSP, FOWLP, Novel SIP Structures, EV/eVTOL; Enabling Materials & Advanced Equipment and Processes; and Design & Modeling, AI Enablement, CPI and Metrology.
Visit QP Technologies at the show to learn about our packaging and assembly capabilities for microelectronics. Contact us to schedule a time to meet with our team!