Semiconductor Packaging & Assembly Services
End-to-End Semiconductor Packaging, Assembly, and Engineering Support
QP Technologies provides a full range of semiconductor services including wafer preparation, IC assembly, advanced packaging, substrate development, laser micromachining, and design engineering support.
Our capabilities support prototype through production programs across aerospace, defense, medical, and commercial microelectronics applications, with flexible engagement models for stand-alone services or complete turnkey solutions.
Full-Service Semiconductor Capabilities
QP Technologies delivers integrated packaging and assembly services designed to reduce handoffs, improve yield, and accelerate time to market. Services can be deployed individually or as part of a complete manufacturing flow based on your project requirements.
Wafer Preparation & Backgrinding
Precision wafer processing services to prepare wafers and die for downstream assembly and packaging.
Capabilities include:
- Wafer backgrinding and thinning (<100 µm)
- Wafer dicing across multiple materials (silicon, glass, ceramic, etc.)
- Die sort and pick & place
- 100% inspection (commercial, MIL-STD-883, or custom)
- Wafer cleaning and surface preparation
- Ultra-thin wafer handling and thickness control
- Support for wafers up to 300mm
IC Assembly Services
Comprehensive IC assembly capabilities supporting a wide range of package types and configurations.
Capabilities include:
- Die attach and wafer bonding
- Wire bonding and flip chip assembly
- Encapsulation and molding
- Flattening and remolding
- Marking and branding
- BGA sphere attach
- Open cavity and overmolded package options
Advanced Assembly & Packaging
Advanced packaging solutions for complex, high-performance semiconductor devices and next-generation architectures.
Capabilities include:
- Chip-on-board (COB) and chip-on-flex (COF)
- Multichip modules (MCMs)
- System-in-package (SiP)
- Stacked die and chiplets
- MEMS and sensor packaging
- Heterogeneous integration approaches
Substrate Development
Custom substrate design and development to support electrical, thermal, and mechanical performance requirements.
Capabilities include:
- Substrate design and layout
- Fabrication and assembly
- Custom substrate solutions
- Support for advanced and application-specific packaging strategies
Laser Micromachining
Precision laser processing for advanced materials and microelectronic applications.
Capabilities include:
- Fine feature machining
- Material removal across sensitive substrates
- Custom process development
- Prototype and production support
Design & Engineering Support
Engineering collaboration to accelerate development and ensure manufacturable, high-reliability package solutions.
Support includes:
- Package design guidance
- Design-for-manufacturability (DFM)
- Process development and optimization
- Rapid prototyping support for fabless companies
Applications Supported
QP Technologies supports a wide range of semiconductor packaging applications, including:
- Wafer-Level Packaging (WLP)
- Flip Chip Assembly
- Chip Scale Packaging (CSP)
- High-Reliability Microelectronics
- Aerospace & Defense Electronics
- Medical Device Semiconductor Packaging
Integrated Packaging & Assembly Solutions
These services are designed to work together as part of a seamless semiconductor manufacturing flow. By combining wafer preparation, assembly, and packaging under one roof, QP Technologies helps reduce risk, improve traceability, and shorten development cycles.
Why QP Technologies
- Broad in-house semiconductor capabilities
- Support for both standard and advanced package structures
- Flexible stand-alone or turnkey service models
- Experience in high-reliability industries
- Faster path from prototype to production
Request a Quote
Need support with wafer preparation, IC assembly, or advanced packaging?