At QP Technologies (formerly Quik-Pak), we offer a range of services to meet your packaging and assembly requirements. These include wafer preparation (backgrinding, dicing, die sort and inspection); IC assembly for a variety of package types and materials, as well as die attach, wire bonding, flip chip, encapsulation and marking; advanced assembly for new and complex packaging structures; laser micromachining; and design and engineering.
Our wafer-preparation services are offered as part of your total packaging and assembly project or as stand-alone services based on your individual needs. With our advanced wafer processing equipment, QP Technologies offers expert backgrinding and dicing services for all of your packaging needs.
For your assembly requirements, we offer a full range of services. Our prototype IC assembly services include wafer preparation (as noted above), die bonding, IC packaging, wire bonding, encapsulation, flattening/remolding, marking/branding IC packages and BGA sphere attach. Our advanced assembly capabilities include chip-on-board (COB) / chip-on-flex (COF), multichip modules (MCMs), systems-in-package (SiPs), flip-chip bonding, stacked die, chiplets, MEMS, and other structures.
If you have requirements for laser micromachining, we can meet them in a variety of ways, on just about any material, using a precision laser-processing system. And if you’re a fabless chipmaker, we have a full range of design and engineering services to help you find creative ways to get your new products to market quickly.