QP Technologies (formerly Quik-Pak) performs IC assembly for a variety of package types and materials, using proven quality manufacturing processes to meet your project requirements. We process orders from a single part to thousands, and we can easily accommodate multiple variations within a single build. We continually make capital investments to ensure we can assemble your valuable devices using the latest equipment and techniques.
Our complete IC assembly services span from wafer preparation with wafer thinning and dicing, to flip chip die bonding, wire bonding, encapsulation, IC package marking/branding, and BGA sphere attach, and we can supply you with IC packages.
Our standard turn time for prototype assembly services is as quick as three business days. However, we can expedite this timeframe to meet the dictates of your timeline, delivering your project in 1-2 days or even as little as 8 hours, if needed.
Whatever your requirements, QP Technologies can meet them.
Additional IC assembly services provided by QP Technologies include:
- Wire Bonding
- Encapsulation Options
- Marking/Branding IC Packages
- BGA Ball Attach
- Flip Chip Assembly
- Laser Micromachining