IC Assembly Services

Precision Semiconductor Assembly for Prototype and Production Applications

Bringing a semiconductor device from design to market requires more than simply attaching a die. Reliable IC assembly requires precision processes, advanced equipment, and deep packaging expertise to ensure electrical performance, mechanical reliability, and long-term device integrity.

QP Technologies provides comprehensive IC assembly services for prototype, development, and production programs. Our experienced team supports a wide range of package types, materials, and assembly requirements—from individual prototypes to thousands of devices—helping engineers accelerate time to market while maintaining quality and reliability.

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What Is IC Assembly?

IC assembly is the process of integrating semiconductor die into a finished package that protects the device and enables connection to a circuit board or system.

The assembly process may include:

  • Die attach
  • Wire bonding
  • Flip chip assembly
  • Encapsulation
  • Package marking
  • BGA ball attach
  • Inspection and quality control

QP Technologies supports both standard and custom IC packaging requirements for a wide range of semiconductor applications.

QP Technologies IC Assembly Capabilities

Die Attach & Wafer-Level Processing

QP Technologies supports precision die integration using proven assembly processes designed for semiconductor reliability.

Capabilities include:

  • Wafer preparation
  • Wafer thinning and dicing
  • Precision die placement
  • Die attach processes
  • Multi-die integration support

These processes enable reliable assembly of complex semiconductor devices across a variety of package platforms.

Wire Bonding

Wire bonding remains one of the most widely used semiconductor interconnect technologies due to its flexibility, reliability, and compatibility with many package types.

QP Technologies supports:

  • Gold wire bonding
  • Aluminum wire bonding
  • Fine wire applications
  • Custom wire configurations
  • Prototype and production assembly

Flip Chip Assembly

For applications requiring increased performance and higher-density interconnects, flip chip technology provides direct electrical connection between the die and substrate.

QP Technologies supports flip chip assembly processes including:

  • Die placement
  • Bump/interconnect integration
  • Reflow processes
  • Underfill applications
  • Package integration

Encapsulation & Package Protection

Protecting semiconductor devices from environmental and mechanical stress is critical for long-term reliability.

QP Technologies provides:

  • Epoxy encapsulation
  • Molded package solutions
  • Open cavity package options
  • Custom protection approaches

IC Package Options

QP Technologies supports a variety of package configurations, including:

  • Open-cavity plastic packages (OCPP)
  • Open-molded plastic packages (OmPP)
  • Ceramic packages
  • Plastic packages
  • Custom package configurations
  • BGA packages

Contact QP Technologies to discuss your IC assembly requirements.

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Additional IC assembly services provided by QP Technologies include: