In order to accommodate your unique packaging needs, QP Technologies (formerly Quik-Pak) can assist with developing a custom package solution. In addition to utilizing our custom substrate design & fab service, custom packages are offered in QFN package styles in as little as 3 weeks. QP Technologies can also use a variety of in-house techniques to adapt and modify existing packages.
Our Laser Micromachining system can create precision fiducials, holes, slots, channels, grooves, steps and cavities into just about any material.
If you already have custom plastic packages parts, we can utilize our Open Cavity Plastic Package process to prepare those packaged parts for assembly of your new silicon die, allowing you to test your new versions in the same test platform as your existing product.