At QP Technologies (formerly Quik-Pak), we are committed to sustaining and growing our line of industry-leading packages and substrate capabilities to ensure we have what you need when you need it. We have demonstrated and verified the effectiveness of our products and processes. You can depend on us to address your packaging, assembly and wafer-preparation needs, whether urgent or longer-term, with the same attention to quality and speed of delivery.
With our state-of-the-art manufacturing line, proven processes, and engineering brain trust, we have the flexibility to address your specific needs, using our proven packaging technologies. We can provide virtually any package you need for your prototype devices, including Open-molded Plastic Packages (OmPP)®, Open-cavity Plastic Packages (OCPP)®, ceramic and plastic IC packages, laminate substrates, and even custom IC package configurations.
Our exclusive OmPP line of pre-molded, air-cavity quad flat no-lead (QFN) packages come in a variety of sizes for prototype, mid-volume or volume production. Our Open-cavity Plastic Packages (OcPP) are mechanically and electrically identical to your future transfer molded production parts, so they are well suited for new IC prototypes and help to speed your design verification and time to market.
We also offer a full complement of substrate development capabilities for advanced IC and MEMS devices. By providing turnkey custom substrate-based assemblies – from design to fabrication to packaging – we can meet your unique and complex packaging requirements in very short order.