Our Markets Served
Different types of packages serve different functions. Many newer packages are application-specific, with functionality built into them to help improve such device parameters as performance, power efficiency and signal integrity. This creates new challenges for package design, assembly and testing, as well as wafer preparation services that streamline getting your chip-scale and other complex packages to market on time.
No matter your end product or application, QP Technologies (formerly Quik-Pak) will work with you to develop the packaging and assembly solutions you need to meet your time-to-market requirements. Our technologies and services deliver benefits for a range of markets, including several key ones that are strongly aligned with our offerings, as shown below. For more information, please click on the links.
Comprising primarily consumer applications, this always high-demand segment is creating new business for QP Technologies with the rise of internet of things (IoT) and artificial intelligence (AI). Read More
We provide solutions for a range of customers in the industrial market – a prime example is makers of RF/microwave and optoelectronic devices. Read More
We’re excited to provide solutions for this market, which is exploding due to the amount of semiconductor content being incorporated into vehicles, particularly in sensors. Read More
With our ISO 13485:2016 certification, QP Technologies provides quick-turn prototypes and production quantities that meet this vital market’s stringent quality and testing standards. Read More
As with the medical market, military/aerospace applications have rigorous standards to which packaged devices must adhere, and we are well equipped to handle these requirements. Read More