Technical Information

QP Technologies (formerly Quik-Pak) strives to provide our customers with the latest information about our wide variety of microelectronic packaging and assembly and wafer preparation products and services. Please check back often to find updated information and new offerings.

Data SheetDownload
Open Cavity Plastic Packages (OCPP) iMAPS 2022 Poster Presentation HandoutDownload
Design Rules for Package SubstratesDownload
Wafer Preparation & Die Sort DatasheetDownload
Open-molded Plastic Package (OmPP®) DatasheetDownload
Open-molded Plastic Package Part Number Table DatasheetDownload
Open Cavity Plastic Packages (OCPP) DatasheetDownload
Prototype Assembly Services DatasheetDownload
Encapsulation Options DatasheetDownload
Flip Chip Packaging & Advanced Assembly Services DatasheetDownload
Laser Micromachining and Manufacturing DatasheetDownload
BGA Balling Services DatasheetDownload
Ceramic Packaging and Assembly DatasheetDownload