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QP Technologies™ Achieves ANSI/ESD S20.20 Certification

Certification and Ongoing Monitoring Assures Customers of Manufacturing Operations’ ESD Control and Safety ESCONDIDO, Calif. – April 11, 2024 – QP Technologies™, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has been certified ANSI/ESD S20.20-compliant by TÜV SÜD America Inc. – one of only six […]

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February 2024 Newsletter

Subscribe to our email newsletter to stay updated on what’s happening at QP Technologies! Read our February 2024 newsletter for more on:

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QP Technologies™ Achieves ISO Certifications from Global Auditing and Certification Body TÜV SÜD America Inc.

ESCONDIDO, Calif., Nov. 28, 2023 (GLOBE NEWSWIRE) — QP Technologies™, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has achieved ISO 9001:2015 and ISO 13485:2016 certifications from globally recognized standards auditing and certification body TÜV SÜD America Inc. (TÜV SÜD). Developed and published by the International […]

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ECTC 2023: 3D InCites Podcast

Listen to 3D InCites recently published podcast from ECTC 2023. Our CEO, Dick Otte, is featured at 13:55 in which he discusses the impact of the CHIPS Act and his key takeaways from ECTC’s special discussion panel on the act itself.

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ECTC 2023: Chips ACT Presentation – Dick Otte, CEO

This brief presentation was the third given at the start of the “Special Session on the CHIPS Act” at ECTC 2023 in Orlando Florida. The two proceeding talks were by Carl McCants, DARPA and Robert Rudnitsky, NIST. Other panelists were; Hern Takiar, Micron; Joshua Dillon, Marvell; Subramanian Iyer, UCLA.  The moderators […]

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Enabling New Functionality in Medtech and Biotech Devices

By Dick Otte, CEO, Promex Industries Medtech and biotech devices are uniquely suited to benefit from emerging electronic capabilities – specifically, the kind of electronics design, packaging and assembly offerings that are Promex’s specialty. With that said, these markets present a variety of manufacturing challenges and demands that require heterogeneous […]

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Optimizing Chiplet Packaging for Complex Applications

By Dick Otte, CEO, Promex Industries Cost and performance are the two most pressing issues in chip design and manufacturing. Chiplets are a key solution being pursued by the semiconductor industry to help mitigate these challenges. These small die with specialized functionality are designed to be combined to make up a […]

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QP Technologies™ Broadens Microelectronics Plastic-Package Portfolio

New TQFP and MQFP Offerings Increase Packaging Options for Mil-Aero, Automotive and Other Key Markets ESCONDIDO, Calif. – March 16, 2023 – QP Technologies™, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has extended its broad plastic package assembly portfolio with two new offerings: a 64-pin thin quad flat pack […]

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