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Open-Cavity Plastic Packages: A Practical Approach to IC Prototyping

Developing a new IC involves more than designing and fabricating the die. At some point, the device needs to be assembled into a package so engineers can begin electrical testing, characterization, and system-level evaluation. For early-stage prototypes, time can become a packaging constraint of its own. Waiting for new package […]

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June 2026 Newsletter

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Packaging: The Make-or-Break Factor in mmWave Performance

Millimeter-wave (mmWave) technology occupies the short-range, high-frequency portion of the electromagnetic spectrum—typically defined as 30 to 300 GHz—and is enabling a new generation of ultra-fast, high-capacity wireless communication and high-resolution sensing. From 5G and emerging 6G networks to satellite communications and advanced military and aerospace systems, mmWave devices are central […]

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Promex Industries and QP Technologies Appoint David Fromm President and Chief Operating Officer 

Experienced Technology Leader to Drive Innovation and Guide Next Chapter of Operational Growth for Pioneering Microelectronics Assembly Organizations. SANTA CLARA and ESCONDIDO, Calif. — April 30, 2026 — Promex Industries and its QP Technologies division today announced the appointment of David Fromm as president and chief operating officer of both organizations, effective immediately.   Fromm brings deep expertise in advanced instrumentation, process development, and technology leadership to his expanded role. Since joining Promex, he has been […]

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February 2026 Newsletter

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Lead Frames: The Unsung Backbone of Modern Semiconductor Packaging

When you think about semiconductor innovation, advanced nodes, novel materials, or sophisticated system architectures are what typically come to mind. Packaging is often viewed as a final step – a mere protective shell around the “real” technology, but for today’s devices, the package is key to device performance, reliability and […]

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Raising the Bar for Mission-Critical Quality: Why Achieving AS9100D Matters 

At QP Technologies, we take pride in delivering high-reliability assembly and packaging for our customers, who are building some of the world’s most demanding electronics. Now, we have reached a major milestone: achieving AS9100D certification—one of the most rigorous and globally recognized quality management standards for aerospace, defense, and space […]

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November 2025 Newsletter

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BLOG: Supporting the Future of High-Frequency Electronics

The world is moving rapidly toward a future where high-frequency electronics (HFE) will be the backbone of communications, sensing, and advanced computing. Applications such as 5G and 6G wireless networks, low-Earth-orbit satellite constellations, automotive radar, and military-grade communications all depend on devices capable of operating reliably at frequencies that were […]

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July 2025 Newsletter

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February 2025 Newsletter

Subscribe to our email newsletter to stay updated on what’s happening at QP Technologies and our parent company, Promex Industries! Read our February 2025 newsletter for more on:

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