February 2026 Newsletter
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Blog
Lead Frames: The Unsung Backbone of Modern Semiconductor Packaging
When you think about semiconductor innovation, advanced nodes, novel materials, or sophisticated system architectures are what typically come to mind. Packaging is often viewed as a final step – a mere protective shell around the “real” technology, but for today’s devices, the package is key to device performance, reliability and […]
Raising the Bar for Mission-Critical Quality: Why Achieving AS9100D Matters
At QP Technologies, we take pride in delivering high-reliability assembly and packaging for our customers, who are building some of the world’s most demanding electronics. Now, we have reached a major milestone: achieving AS9100D certification—one of the most rigorous and globally recognized quality management standards for aerospace, defense, and space […]
November 2025 Newsletter
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Promex and QP Technologies Appoint Ben Mendoza Vice President of Military Projects
Experienced Industry Leader to Define and Execute Expanded Mil-Aero Strategy SANTA CLARA, Calif. – October 6, 2025 – Microelectronics and packaging assembly leaders Promex Industries, Inc., and its QP Technologies division today announced that Ben Mendoza has been named vice president of military projects for the two companies, reporting to […]
BLOG: Supporting the Future of High-Frequency Electronics
The world is moving rapidly toward a future where high-frequency electronics (HFE) will be the backbone of communications, sensing, and advanced computing. Applications such as 5G and 6G wireless networks, low-Earth-orbit satellite constellations, automotive radar, and military-grade communications all depend on devices capable of operating reliably at frequencies that were […]
July 2025 Newsletter
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February 2025 Newsletter
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November 2024 Newsletter
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Leveraging Custom Substrates to Deliver Quickturn Packaging and Assembly Solutions
Substrate materials play an important role in microelectronics. Serving as the backbone of integrated circuit assemblies, substrates promote mechanical strength and electrical connectivity. Manufacturers choose from a range of substrate materials when building devices, including advanced laminates such as FR-4, FR-5, BT and ABF. Driven by the advancement of applications […]
July 2024 Newsletter
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Promex Industries and QP Technologies Implement Sales/Marketing Reorganization, Promoting Rosie Medina to Promex Senior Vice President and Matt Hansen to QP Technologies Vice President
Two companies heightening focus on individual core competencies to better pursue rapidly expanding business opportunities. SANTA CLARA, Calif., July 29, 2024 – Promex Industries, a Silicon Valley-based provider of advanced design, packaging and microelectronics assembly services, and its San Diego-based division QP Technologies, a leading provider of innovative microelectronic packaging and assembly […]