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3dInCites Podcast: A Conversation about Reshoring Advanced Packaging in the US

The acronyms involving funding for semiconductor manufacturing are flying around Washington. There is the Chips for America Act, focused on re-shoring, The Facilitating American-Built Semiconductors (FABS) Act that promises tax credits for investments in, either equipment or fabs. and then there’s the $250 billion US Innovation and Competition Act, which…

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Rethinking “Business as Usual”

By Rosie Medina, Vice President, Sales and Marketing Few things can snap your priorities into focus like the onset of a pandemic. Our industry is known for its cyclical nature, so adapting to change is not a new concept. But dealing with the challenges posed by COVID-19 has been like…

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QP Technologies™ Expands Interposer Design Capabilities

Leverages Substrate Design Services to Create Flexible, Low-Cost Packaging Solutions ESCONDIDO, Calif. – March 29, 2021 – QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced expanded capabilities related to interposer designs for flip-chip and large-cavity packaging as an extension of the company’s substrate design services announced last year.…

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Quik-Pak Becomes QP Technologies™

New brand reflects growing breadth of company’s technology and engineering capabilities ESCONDIDO, Calif., March 11, 2021 (GLOBE NEWSWIRE) -- Leading provider of microelectronic packaging and assembly solutions Quik-Pak today announced the business’s new name QP Technologies™. This change and the related rebranding are a natural outgrowth of the company’s evolution, including…

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New Year, New Name, More Capabilities

By Ken Molitor, Chief Operating Officer, QP Technologies A new year always brings the promise of a fresh start, a chance to reset, reinvigorate and perhaps refocus goals and objectives. This may never have been truer than when 2021 arrived. In February 2020, we moved our operations into our new,…

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Evolving Heterogeneous Integration Roadmap Highlights Trends

As noted in last month’s blog post, the semiconductor industry has turned its efforts toward the ongoing fleshing out of a roadmap focused on advancing heterogeneous integration (HI). HI integrates separately manufactured components into higher-level assemblies such as systems-in-package (SiPs), offering higher bandwidth and functionality and lower power consumption in…

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Wafer Preparation: Thin Is In

The push to create smaller, thinner and denser chip packages is on… and has been for some time. A few years ago, it became clear that the way forward for the semiconductor industry was to intensify the focus on heterogeneous integration (HI)—integrating separately manufactured components into a system-in-package (SIP), a…

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Quik-Pak, Agile Microwave Technology and OMMIC Verify RF-Capable Packaging Solutions for 5G and IoT Semiconductor Devices

Collaboration Targets Packaging for Millimeter-Wave Applications Escondido, CA – October 6, 2020: Quik-Pak, together with Agile Microwave Technology (AgileMwT) and OMMIC SA, today announced its line of JEDEC-compliant air-cavity QFN packages. The Quik-Pak openmolded plastic packages (OmPP®) are RF-capable to data rates of 43GHz, which will help speed availability of…

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RF/Microwave Packaging Demands on the Rise

RF and microwave integrated circuits (ICs), monolithic microwave ICs (MMICs) and systems in package (SiPs) are vital for a wide range of applications. These include mobile phones, wireless local-area networks (WLANs), ultra-wideband (UWB), internet-of-things (IoT), GPS and Bluetooth devices. Moreover, RF-optimized packaging products and processes are essential to enabling the…

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Quik-Pak Relocates to Larger, Customized Facility

New 20,000 SF Building Is Operational and Supporting Essential Businesses Escondido, CA – April 7, 2020: Quik-Pak, a provider of innovative microelectronic packages, assembly and wafer-processing solutions, today announced it has relocated all operations to its new facility at 2063 Wineridge Place in Escondido. Download Press Release

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