News & Blog

Blog

QP Technologies™ Broadens Microelectronics Plastic-Package Portfolio

New TQFP and MQFP Offerings Increase Packaging Options for Mil-Aero, Automotive and Other Key Markets ESCONDIDO, Calif. – March 16, 2023 – QP Technologies™, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has extended its broad plastic package assembly portfolio with two new offerings: a 64-pin thin quad flat pack […]

Learn More

Panel Tackles Chiplet Packaging Challenges

By Dean Freeman QP Technologies recently exhibited at the first Chiplet Summit, held January 24-26 in San Jose, California. Dick Otte, CEO of our parent company Promex Industries, participated on a panel titled “Best Packaging for Chiplets Today.” Moderated by Nobuki Islam with JCET Group, the packaging panel also included […]

Learn More