Blog
QP Technologies Partners with AnySilicon
AnySilicon, the leading marketplace for semiconductor service providers, announced today that QP Technologies, a worldwide leader in packaging and assembly services, has partnered with AnySilicon to promote its IC packaging and assembly services. As part of the AnySilicon platform, QP Technologies will gain access to a full range of online marketing services to showcase its offering, increase exposure and generate leads.
Aluminum Wire Bonding Key for Power Electronics
A few months ago, we announced that we had expanded our wire bonding offerings by adding two bonders from Hesse Mechatronics to our manufacturing line. The systems – a Bondjet BJ855 fine wire wedge bonder and a Bondjet BJ939 heavy wire wedge bonder – deliver industry-leading bonding speed and large […]
iMAPS 2021 Recap – A Great Show
Earlier this month, we were excited to be live onsite at iMAPS 2021 in San Diego, just down the freeway from our manufacturing facility in Escondido. It was great to meet with and talk to attendees in person, chatting with folks in our booth and getting a chance to talk […]
October 2021 Quick Shots
October 2021 Newsletter
QP Technologies™ Sees Double-Digit Growth, Expands Team and Offerings to Meet Customer Needs
Demand for Packaging and Assembly Expertise Continues to Escalate ESCONDIDO, Calif. – Sept. 29, 2021 – QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, has added multiple new positions and capabilities to accommodate rising customer requirements. The company emerged from the global pandemic stronger […]
September 2021 Quick Shots
September 2021 Newsletter
3dInCites Podcast: A Conversation about Reshoring Advanced Packaging in the US
The acronyms involving funding for semiconductor manufacturing are flying around Washington. There is the Chips for America Act, focused on re-shoring, The Facilitating American-Built Semiconductors (FABS) Act that promises tax credits for investments in, either equipment or fabs. and then there’s the $250 billion US Innovation and Competition Act, which […]
QP Technologies™ Installs New Wire Bonders, Broadening Reach in Mil-Aero, RF, Power Markets
Hesse Fine and Heavy Wire Bonders Enable Fully Automated Processing of Assembly Projects ESCONDIDO, Calif. – August 16, 2021 – QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has installed two new Hesse Mechatronics ultrasonic wire bonders at its wholly owned […]