Blog
Fall 2022 Newsletter
QP Technologies™ Boosts Process Capabilities, Expands Team to Target New and Growing Markets
Improvements Designed to Meet Escalating Demand for Packaging and Assembly Expertise BOSTON, Oct. 03, 2022 – QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced it is expanding its process capabilities in response to rising customer demand for its offerings, which also include wafer preparation […]
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QP Technologies Partners with AnySilicon
AnySilicon, the leading marketplace for semiconductor service providers, announced today that QP Technologies, a worldwide leader in packaging and assembly services, has partnered with AnySilicon to promote its IC packaging and assembly services. As part of the AnySilicon platform, QP Technologies will gain access to a full range of online marketing services to showcase its offering, increase exposure and generate leads.