Microelectronics & Semiconductor Blog

Raising the Bar for Mission-Critical Quality: Why Achieving AS9100D Matters

At QP Technologies, we take pride in delivering high-reliability assembly and packaging for our customers, who are building some of the world’s most demanding electronics. Now, we have reached a major milestone: achieving AS9100D certification—one of the most rigorous and globally recognized quality management standards for aerospace, defense, and space […]

Learn More

November 2025 Newsletter

Subscribe to our email newsletter to stay updated on what’s happening at QP Technologies! Read our November 2025 newsletter for more on:

Learn More

Promex and QP Technologies Appoint Ben Mendoza Vice President of Military Projects

Experienced Industry Leader to Define and Execute Expanded Mil-Aero Strategy SANTA CLARA, Calif. – October 6, 2025 – Microelectronics and packaging assembly leaders Promex Industries, Inc., and its QP Technologies division today announced that Ben Mendoza has been named vice president of military projects for the two companies, reporting to […]

Learn More

BLOG: Supporting the Future of High-Frequency Electronics

The world is moving rapidly toward a future where high-frequency electronics (HFE) will be the backbone of communications, sensing, and advanced computing. Applications such as 5G and 6G wireless networks, low-Earth-orbit satellite constellations, automotive radar, and military-grade communications all depend on devices capable of operating reliably at frequencies that were […]

Learn More

July 2025 Newsletter

Subscribe to our email newsletter to stay updated on what’s happening at QP Technologies! Read our July 2025 newsletter for more on:

Learn More

February 2025 Newsletter

Subscribe to our email newsletter to stay updated on what’s happening at QP Technologies and our parent company, Promex Industries! Read our February 2025 newsletter for more on:

Learn More

November 2024 Newsletter

Subscribe to our email newsletter to stay updated on what’s happening at QP Technologies and our parent company, Promex Industries! Read our November 2024 newsletter for more on:

Learn More

Leveraging Custom Substrates to Deliver Quickturn Packaging and Assembly Solutions

Substrate materials play an important role in microelectronics. Serving as the backbone of integrated circuit assemblies, substrates promote mechanical strength and electrical connectivity. Manufacturers choose from a range of substrate materials when building devices, including advanced laminates such as FR-4, FR-5, BT and ABF. Driven by the advancement of applications […]

Learn More

July 2024 Newsletter

Subscribe to our email newsletter to stay updated on what’s happening at QP Technologies! Read our July 2024 newsletter for more on:

Learn More

Promex Industries and QP Technologies Implement Sales/Marketing Reorganization, Promoting Rosie Medina to Promex Senior Vice President and Matt Hansen to QP Technologies Vice President

Two companies heightening focus on individual core competencies to better pursue rapidly expanding business opportunities. SANTA CLARA, Calif., July 29, 2024 – Promex Industries, a Silicon Valley-based provider of advanced design, packaging and microelectronics assembly services, and its San Diego-based division QP Technologies, a leading provider of innovative microelectronic packaging and assembly […]

Learn More

QP Technologies™ Expands Die Preparation Business

Adds Fully Automated Dicing Saw to Equipment Line, Enabling Even Greater Precision, Throughput for Die Singulation ESCONDIDO, Calif. – June 19, 2024 – QP Technologies™, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has added a state-of-the-art dicing saw to its manufacturing line, expanding its […]

Learn More

QP Technologies™ Achieves ANSI/ESD S20.20 Certification

Certification and Ongoing Monitoring Assures Customers of Manufacturing Operations’ ESD Control and Safety ESCONDIDO, Calif. – April 11, 2024 – QP Technologies™, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has been certified ANSI/ESD S20.20-compliant by TÜV SÜD America Inc. – one of only six […]

Learn More

News & Blog