Leaded Plastic Package Drawings*

QP Technologies (formerly Quik-Pak) offers leaded plastic packages in a variety of sizes and types, ensuring your ability to continue using these solutions for a range of applications from prototype to full production. Options include mini small outline package (MSOP), plastic dual inline package (PDIP), quarter size outline package (QSOP), small outline integrated circuit (SOIC), shrink small outline package (SSOP) and thin SSOP (TSSOP).

PQFP

Package Type Body Size (in.)Lead CountLead Pitch (mm)Download PDF*
TQFP eP10×10640.5Download
MQFP10×10520.65Download

SOIC

Package Type Body SizeLead CountLead Pitch (mm)Dap Size (mm)Download PDF*
SOIC0.150 wide81.2795×150 Download
SOIC0.150 wide141.2790×168Download
SOIC0.150 wide161.2790×160Download

*The drawings provided on our website are examples of the packages offered and may not reflect the latest revisions. For the most up-to-date drawings, please reach out to our sales team. They will be happy to assist you and provide you with the latest versions.