Substrate Fabrication & Assembly
Utilizing virtually any substrate type, QP Technologies (formerly Quik-Pak) can create turnkey solutions for substrate-based assemblies to accommodate your unique packaging requirements. And our delivery times are at least 50 percent faster than those of competitive services.
Selecting a domestic or international fab partner involves a number of variables. We will manage this process for you, taking these factors into consideration, including, to name a few:
- ITAR restrictions
- ISO certification
- Cleanroom size and class rating
You can design the board yourself or rely on us to manage the design process for you. Once the designs are ready, we will perform a manufacturability review and help you move forward to ensure fab and assembly are completed in a timely manner.
QP Technologies’ turnkey solutions for substrate-based assemblies accommodate your unique packaging requirements. Our delivery times are at least 50 percent faster than those of competitive services, helping ensure you meet your time-to-market goals.
Our substrate design and manufacturing capability lets you take advantage of our wirebond BGA and flip-chip interconnect options in the shortest cycle time possible.
If your design project calls for the development of a custom BGA, interposer or other laminate substrate along with assembly services, QP Technologies is the answer. We will coordinate the design and fabrication of your substrate, attach and wire bond your die, encapsulate, mark and attach the solder spheres.
QP Technologies is the solution for all of your substrate assembly needs.