Chiplets continue to grow rapidly in popularity, due in large part to the “More than Moore” push to add further value to semiconductors by migrating some functionalities from the board onto the chip or into the package. Essentially an architecture for integrating existing, pre-qualified die into an IC package, chiplets offer advantages for scaling and yield in a range of products, particularly high-performance devices with sizable memory requirements. These data-intensive applications include artificial intelligence (AI), machine learning, high-performance computing (HPC), and large data centers.

QP Technologies (formerly Quik-Pak) can work with OEMs, designers and foundries to develop the chiplet assembly strategy that best meets your needs. With our flexible assembly processes, we can accommodate the bonding of multiple components, including die and discretes, on a single substrate.

We can also accommodate your advanced assembly requirements for a wide range of structures in addition to chiplets. This includes chip-on-board (COB) / chip-on-flex (COF), multichip modules (MCMs), systems-in-package (SiPs), flip-chip bonding, stacked die, MEMS, and other structures.

To contact a QP Technologies representative and discuss your project scope and requirements, please click here or call 858-674-4676.