Stacked Die

When your device requires the integration of multiple components in a single package, such as ASIC and memory die, a stacked die assembly delivers the smallest footprint and most economical solution. QP Technologies’ (formerly Quik-Pak) unique ability to backgrind individual die enables the finished devices to meet original JEDEC package thickness specifications, and our capabilities in die attach and wire bonding, including die to die and die to substrate bonding, enable prototype assembly of your complicated stacked die devices.