Commercial applications comprise primarily consumer end products, such as smartphones, tablets and in-home entertainment systems. This high-demand segment is creating new business for QP Technologies (formerly Quik-Pak) – particularly with the rise of internet of things (IoT) and artificial intelligence (AI), which pose exciting opportunities for packaging… not to mention challenges that we are well equipped to address.
In addition, the convergence of media and data and the need for handheld devices that can handle both on the same platform means that you need the right packaging solutions, optimized to accommodate all of the components that this convergence entails – e.g., RF, antennas, wireless communications (4G/5G/6G), Bluetooth, high-speed I/O (USB, PCIe, etc.)
These commercial market product cycles are very fast and involve very high volumes, requiring packaging solutions that align with these requirements. QP Technologies has long been known for our ability to provide quick-turn prototyping solutions that meet your unique packaging and assembly needs. Adding in our wafer preparation – backgrinding and dicing – and die inspection capabilities provides a complete, turnkey solution that will help ensure your ability to meet your time-to-market and cost goals.
To contact a QP Technologies representative and discuss your project scope and requirements, please click here or call 858-674-4676.