Materials Information

QP Technologies (formerly Quik-Pak) utilizes industry standard materials for die attach and encapsulation, offering a range of options to meet your specific needs.

The below datasheets represent some of the materials that we have in stock for current customer programs.  If a specific die attach or encapsulation material is needed that is not listed below, please ask since we may carry it. Contact QP Technologies customer service.

TypeDownload
Die Attach OptionNon-Conductive84-3Download PDF
Die Attach Option Non-ConductiveQMI538NBDownload PDF
Die Attach Option Conductive & Low ModulusQMI529HT Download PDF
Die Attach OptionConductive84-1 LMIDownload PDF
Die Attach OptionHigh Thermal & Electrical ConductivityAtrox 800HT2VDownload PDF
Die Attach OptionHigh Thermal & Electrical ConductivityAtrox 800HT5Download PDF
Die Attach OptionSolderSN63 or SAC305
Encapsulation OptionStandardHysol FP4451 (Dam) / FP4450 (Fill)Download PDF
Encapsulation OptionLow StressHysol FP4651Download PDF
OvermoldStandardSumitomo EME-G770H Type DDownload PDF
UnderfillStandardNamic U8443-14Download PDF

Alternative epoxies can be supported upon request at customers’ expense and may impact schedule.