Materials Information

QP Technologies (formerly Quik-Pak) utilizes industry standard materials for die attach and encapsulation, offering a range of options to meet your specific needs.

The below datasheets represent some of the materials that we have in stock for current customer programs.  If a specific die attach or encapsulation material is needed that is not listed below, please ask since we may carry it. Contact QP Technologies customer service.

Die Attach OptionNon-ConductiveQMI538NBDownload PDF
Die Attach OptionConductiveQMI529HTDownload PDF
Die Attach OptionConductiveH20EDownload PDF
Die Attach OptionSuper Thermally & Electrically ConductiveSk70NDownload PDF
Die Attach OptionSolderIndium 6.3Download PDF
Encapsulation OptionStandardHysol FP4323Download PDF
Encapsulation OptionLow StressHysol CB064/FP4653Download PDF