Materials Information
QP Technologies (formerly Quik-Pak) utilizes industry standard materials for die attach and encapsulation, offering a range of options to meet your specific needs.
The below datasheets represent some of the materials that we have in stock for current customer programs. If a specific die attach or encapsulation material is needed that is not listed below, please ask since we may carry it. Contact QP Technologies customer service.
Type | Download | ||
---|---|---|---|
Die Attach Option | Non-Conductive | QMI538NB | Download PDF |
Die Attach Option | Conductive | QMI529HT | Download PDF |
Die Attach Option | Conductive | H20E | Download PDF |
Die Attach Option | Super Thermally & Electrically Conductive | Sk70N | Download PDF |
Die Attach Option | Solder | Indium 6.3 | Download PDF |
Encapsulation Option | Standard | Hysol FP4323 | Download PDF |
Encapsulation Option | Low Stress | Hysol CB064/FP4653 | Download PDF |