Encapsulation Options

After wire bonding, QP Technologies (formerly Quik-Pak) offers several options for encapsulation of your devices, providing the level of protection and/or accessibility that you need. Options include:

Fully Closed

Flattened / Remolded: Packages are fully encapsulated with filled epoxy, utilizing QP Technologies proprietary molding process. Packages are returned to their original mechanical state, meeting JEDEC standards and providing test socket compatibility.

Glob Top: Packages are fully encapsulated with filled epoxy and have a domed surface.

Clear Encapsulant: Packages are fully encapsulated with non-filled epoxy and have a domed surface for bonding verification, visual samples and optical applications.

Partially Closed

Partial Encapsulation: Packages are encapsulated with filled epoxy in selected areas (i.e. around leads only.)

Open

Frames & Lids: No encapsulation. Custom frame around perimeter of package with removable lid to protect die and bond wires, yet provide complete accessibility.

Open Cavity: No encapsulation, die is exposed for total accessibility.

• Air Cavity QFN Open-molded Plastic Packages
• Ceramic IC Packages
• Custom Configurations

• BGA Substrates
• Plastic Overmolded QFN Over-tooled
• Die Attach

• Wire Bonding
• Open Cavity Plastic Packages
• Marking/Branding