After wire bonding, QP Technologies (formerly Quik-Pak) offers several options for encapsulation of your devices, providing the level of protection and/or accessibility that you need. Options include:
Flattened / Remolded: Packages are fully encapsulated with filled epoxy, utilizing QP Technologies proprietary molding process. Packages are returned to their original mechanical state, meeting JEDEC standards and providing test socket compatibility.
Glob Top: Packages are fully encapsulated with filled epoxy and have a domed surface.
Clear Encapsulant: Packages are fully encapsulated with non-filled epoxy and have a domed surface for bonding verification, visual samples and optical applications.
Partial Encapsulation: Packages are encapsulated with filled epoxy in selected areas (i.e. around leads only.)
Frames & Lids: No encapsulation. Custom frame around perimeter of package with removable lid to protect die and bond wires, yet provide complete accessibility.
Open Cavity: No encapsulation, die is exposed for total accessibility.