Die Attach

High Volume Precision Die Attach

QP Technologies (formerly Quik-Pak) offers fully automated die attach and die placement services for prototype and volume assembly.

  • Accuracy within ± 10µm
  • Die bond or flip chip attach

We utilize industry-standard materials for die attach and encapsulation, offering a range of options to meet your specific needs.

Die Attach Options

Non-conductive:
QMI538NB

Conductive:
QMI529HT
H20E

Super Thermally & Electrically Conductive:
Sk70N

Solder:
Indium 6.3

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