Air Cavity QFN Open Molded Plastic Package
Open-molded Plastic Packages (OmPP)®
QP Technologies’ (formerly Quik-Pak) exclusive Open-molded Plastic Package (OmPP) is a pre-molded, air cavity QFN package (Quad Flat No-Lead) designed to provide a high quality, fast solution for your IC packaging and IC assembly needs.
These QFN packages or Open-molded Plastic Packages (OmPP) come in a variety of sizes and are ideal for prototype, mid volume or production volume applications.
Pre-Molded Air Cavity QFN Package Advantages:
- RoHS and REACH Compliant “Green” Molding Compound used to make QFN packages
- Gold Plated QFN Packages
- Superior Bondability
- Custom QFN Body Sizes and Lead Counts available off the shelf
Pre-Molded Air Cavity QFN Packages Offer Flexibility
QP Technologies’ Au/Ni plated QFN Packages are offered in a broad assortment of sizes from 3x3mm to 12x12mm with a variety of pitch options. They are manufactured using a RoHS and REACH compliant “green” molding compound.
QP Technologies’ new OmPP air cavity packages are production quality and are available for rapid delivery to meet customers needs.