Air Cavity QFN Open Molded Plastic Package

Open-molded Plastic Packages (OmPP)®

QP Technologies’ (formerly Quik-Pak) exclusive Open-molded Plastic Package (OmPP) is a pre-molded, air cavity QFN package (Quad Flat No-Lead) designed to provide a high quality, fast solution for your IC packaging and IC assembly needs.

These QFN packages or Open-molded Plastic Packages (OmPP) come in a variety of sizes and are ideal for prototype, mid volume or production volume applications.

Pre-Molded Air Cavity QFN Package Advantages:

  • RoHS and REACH Compliant “Green” Molding Compound used to make QFN packages
  • Gold Plated QFN Packages
  • Superior Bondability
  • Custom QFN Body Sizes and Lead Counts available off the shelf

Pre-Molded Air Cavity QFN Packages Offer Flexibility

QP Technologies’ Au/Ni plated QFN Packages are offered in a broad assortment of sizes from 3x3mm to 12x12mm with a variety of pitch options. They are manufactured using a RoHS and REACH compliant “green” molding compound.

QP Technologies’ new OmPP air cavity packages are production quality and are available for rapid delivery to meet customers needs.

Click here to see package drawings.