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Panel Tackles Chiplet Packaging Challenges

By Dean Freeman QP Technologies recently exhibited at the first Chiplet Summit, held January 24-26 in San Jose, California. Dick Otte, CEO of our parent company Promex Industries, participated on a panel titled “Best Packaging for Chiplets Today.” Moderated by Nobuki Islam with JCET Group, the packaging panel also included […]

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Managing MIL-STD-883 IC Compliance

The military-aerospace market has stringent requirements for parts designed into air, spacecraft, and associated systems. Proven IC and board packaging approaches are essential for enabling system designers to use commercially developed components in military and aerospace applications. MIL-STD-883 is the military testing standard that determines uniform procedures and methodologies for […]

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