Skip to content
QP Technologies
Primary Menu Search
Customer Portal 858.674.4676 Request Quote
  • Services
    • Wafer Preparation
      • [title]
      • Wafer Backgrinding and Dicing
      • Additional Wafer Preparation Services
    • Advanced Assembly
      • [title]
      • Chip on board / Chip on flex
      • Chiplets
      • Flip Chip Bonding
      • Inventory Management / BOM Procurement
      • Multi Chip Module
      • SMT
      • Stacked Die
      • System In Packaging
    • Design & Engineering
    • IC Assembly
      • [title]
      • Air Cavity QFN Open Molded Plastic Package
      • BGA Substrates
      • Ceramic
      • Custom Configurations
      • Die Attach
      • Encapsulation Options
      • IC Marking / IC Branding
      • Open Cavity Plastic Packages
      • Plastic Overmolded QFN Open-tooled
      • Wire Bonding
      • Leaded Plastic Package Drawings
    • Laser Micromachining
  • Products
    • OCPP
    • OmPP
    • Substrate Development
      • [title]
      • Substrate Design
      • Substrate Fabrication & Assembly
  • Markets Served
    • Automotive
    • Commercial
    • Compound Semiconductors
    • Industrial
    • Medical
    • Mil-Aero
    • Power Semiconductors
  • About Us
    • Company Info/Bios
    • Careers
    • Quality
    • Contact Us
    • Request Quote
  • Technical Resources
    • Package Drawings
    • Materials Information
    • Technical Articles, Tech Tips, White Papers
    • Technical Information
  • News & Events
    • News
    • Events
    • Blog
    • Newsletter Archive
    • Quick Shots Archive

December 2021 Newsletter

Dec 18, 2021 · Newsletter Archive
QP-Tech-2021-December-NewsletterDownload

Categories

  • Blog
  • News
  • Newsletter Archive
  • Quick Shots Archive

Recent News

Newsletter Archive

November 2023 Newsletter

QP-Technologies-November-2023-NewsletterDownload

Upcoming Event

IMS 2024

June 16, 2024
IMS is the flagship event in a week dedicated to all things microwaves and RF. The…

A Division of Promex Industries

2063 Wineridge Place Escondido, CA 92029 858.674.4676 | moreinfo@qptechnologies.com

TÜV SÜD America

ISO 9001:2015 Certified
ISO 13485:2016 Certified

ITAR logo Linkedin

Sign up for our Bi-Monthly Newsletter

  • About Us
    • Careers
    • Company Info/Bios
    • Contact Us
      • Thank You
    • Opt-In
      • Thank You
  • Blog
  • Compound Semi
  • Customer Portal
  • Homepage
  • Markets Served
    • Automotive
    • Commercial
    • Compound Semiconductors
    • Industrial
    • Medical
    • Mil-Aero
    • Power Semiconductors
  • MilAero
  • News & Events
    • Thank You For Your Request
  • Page Not Found
  • Privacy Policy
  • Products
    • OCPP
    • OmPP
    • Substrate Development
      • Substrate Design
      • Substrate Fabrication & Assembly
  • QP Technologies Open House 2023 RSVP
  • Request a Facility Tour
  • Request Quote
    • Thank you for your Request
  • Services
    • Advanced Assembly
      • Chip on board / Chip on flex
      • Chiplets
      • Flip Chip Bonding
      • Inventory Management / BOM Procurement
      • Multi Chip Module
      • SMT
      • Stacked Die
      • System In Packaging
    • Design & Engineering
    • IC Assembly
      • Air Cavity QFN Open Molded Plastic Package
      • BGA Substrates
      • Ceramic
      • Custom Configurations
      • Die Attach
      • Encapsulation Options
      • IC Marking / IC Branding
      • Open Cavity Plastic Packages
      • Plastic Overmolded QFN Open-tooled
      • Wire Bonding
    • Laser Micromachining
    • Wafer Preparation
      • Additional Wafer Preparation Services
      • Wafer Backgrinding and Dicing
  • Technical Specs
    • Chip Package Drawings
    • Data Sheets
    • Materials Information
    • Package Drawings
    • Quality Specs
    • Technical Articles, Tech Tips, White Papers
    • Technical Articles, Tech Tips, White Papers Archive
  • Virtual Tour

QP Technologies - A division of Promex Industries © 2022 - This site is protected by reCAPTCHA and QP Technologies' Privacy Policy and Terms of Service apply.