The 55th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS) and held at Hynes Convention Center. This year’s Symposium will focus on PACKAGING TECHNOLOGIES ENABLING THE NEW NORMAL, and will feature 5 technical tracks, plus our Interactive Poster Session. The technical program will span three days of sessions with emphasis on packaging technologies that serve 5G, High Performance Computations, Automotive, Industrial, Defense/Space, Medical electronics markets, and beyond!
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