Advanced Packaging and Assembly Blog

BLOG: Supporting the Future of High-Frequency Electronics

The world is moving rapidly toward a future where high-frequency electronics (HFE) will be the backbone of communications, sensing, and advanced computing. Applications such as 5G and 6G wireless networks, low-Earth-orbit satellite constellations, automotive radar, and military-grade communications all depend on devices capable of operating reliably at frequencies that were […]

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Leveraging Custom Substrates to Deliver Quickturn Packaging and Assembly Solutions

Substrate materials play an important role in microelectronics. Serving as the backbone of integrated circuit assemblies, substrates promote mechanical strength and electrical connectivity. Manufacturers choose from a range of substrate materials when building devices, including advanced laminates such as FR-4, FR-5, BT and ABF. Driven by the advancement of applications […]

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Enabling New Functionality in Medtech and Biotech Devices

By Dick Otte, CEO, Promex Industries Medtech and biotech devices are uniquely suited to benefit from emerging electronic capabilities – specifically, the kind of electronics design, packaging and assembly offerings that are Promex’s specialty. With that said, these markets present a variety of manufacturing challenges and demands that require heterogeneous […]

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Optimizing Chiplet Packaging for Complex Applications

By Dick Otte, CEO, Promex Industries Cost and performance are the two most pressing issues in chip design and manufacturing. Chiplets are a key solution being pursued by the semiconductor industry to help mitigate these challenges. These small die with specialized functionality are designed to be combined to make up a […]

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Panel Tackles Chiplet Packaging Challenges

By Dean Freeman QP Technologies recently exhibited at the first Chiplet Summit, held January 24-26 in San Jose, California. Dick Otte, CEO of our parent company Promex Industries, participated on a panel titled “Best Packaging for Chiplets Today.” Moderated by Nobuki Islam with JCET Group, the packaging panel also included […]

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Aluminum Wire Bonding Key for Power Electronics

A few months ago, we announced that we had expanded our wire bonding offerings by adding two bonders from Hesse Mechatronics to our manufacturing line. The systems – a Bondjet BJ855 fine wire wedge bonder and a Bondjet BJ939 heavy wire wedge bonder – deliver industry-leading bonding speed and large […]

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iMAPS 2021 Recap – A Great Show

Earlier this month, we were excited to be live onsite at iMAPS 2021 in San Diego, just down the freeway from our manufacturing facility in Escondido. It was great to meet with and talk to attendees in person, chatting with folks in our booth and getting a chance to talk […]

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3dInCites Podcast: A Conversation about Onshore Advanced Packaging in the US

The acronyms involving funding for semiconductor manufacturing are flying around Washington. There is the Chips for America Act, focused on re-shoring, The Facilitating American-Built Semiconductors (FABS) Act that promises tax credits for investments in, either equipment or fabs. and then there’s the $250 billion US Innovation and Competition Act, which […]

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Rethinking “Business as Usual”

By Rosie Medina, Vice President, Sales and Marketing Few things can snap your priorities into focus like the onset of a pandemic. Our industry is known for its cyclical nature, so adapting to change is not a new concept. But dealing with the challenges posed by COVID-19 has been like […]

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New Year, New Name, More Capabilities

By Ken Molitor, Chief Operating Officer, QP Technologies A new year always brings the promise of a fresh start, a chance to reset, reinvigorate and perhaps refocus goals and objectives. This may never have been truer than when 2021 arrived. In February 2020, we moved our operations into our new, […]

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Evolving Heterogeneous Integration Roadmap Highlights Trends

As noted in last month’s blog post, the semiconductor industry has turned its efforts toward the ongoing fleshing out of a roadmap focused on advancing heterogeneous integration (HI). HI integrates separately manufactured components into higher-level assemblies such as systems-in-package (SiPs), offering higher bandwidth and functionality and lower power consumption in […]

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Wafer Preparation: Thin Is In

The push to create smaller, thinner and denser chip packages is on… and has been for some time. A few years ago, it became clear that the way forward for the semiconductor industry was to intensify the focus on heterogeneous integration (HI)—integrating separately manufactured components into a system-in-package (SIP), a […]

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