Blog
Optimizing Chiplet Packaging for Complex Applications
By Dick Otte, CEO, Promex Industries Cost and performance are the two most pressing issues in chip design and manufacturing. Chiplets are a key solution being pursued by the semiconductor industry to help mitigate these challenges. These small die with specialized functionality are designed to be combined to make up a […]
February 2023 Newsletter
QP Technologies™ Broadens Microelectronics Plastic-Package Portfolio
New TQFP and MQFP Offerings Increase Packaging Options for Mil-Aero, Automotive and Other Key Markets ESCONDIDO, Calif. – March 16, 2023 – QP Technologies™, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has extended its broad plastic package assembly portfolio with two new offerings: a 64-pin thin quad flat pack […]
Panel Tackles Chiplet Packaging Challenges
By Dean Freeman QP Technologies recently exhibited at the first Chiplet Summit, held January 24-26 in San Jose, California. Dick Otte, CEO of our parent company Promex Industries, participated on a panel titled “Best Packaging for Chiplets Today.” Moderated by Nobuki Islam with JCET Group, the packaging panel also included […]
Winter 2022 Newsletter
Fall 2022 Newsletter
QP Technologies™ Boosts Process Capabilities, Expands Team to Target New and Growing Markets
Improvements Designed to Meet Escalating Demand for Packaging and Assembly Expertise BOSTON, Oct. 03, 2022 – QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced it is expanding its process capabilities in response to rising customer demand for its offerings, which also include wafer preparation […]