September 2021 Quick Shots
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September 2021 Newsletter
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3dInCites Podcast: A Conversation about Reshoring Advanced Packaging in the US
The acronyms involving funding for semiconductor manufacturing are flying around Washington. There is the Chips for America Act, focused on re-shoring, The Facilitating American-Built Semiconductors (FABS) Act that promises tax credits for investments in, either equipment or fabs. and then there’s the $250 billion US Innovation and Competition Act, which…
QP Technologies™ Installs New Wire Bonders, Broadening Reach in Mil-Aero, RF, Power Markets
Hesse Fine and Heavy Wire Bonders Enable Fully Automated Processing of Assembly Projects QP Technologies can create secure aluminum wedge bonds, like those shown in this microscopic image, for RF, power and mil-aero devices using its Hesse Mechatronics bonders. ESCONDIDO, Calif. – August 16, 2021 – QP Technologies™ (formerly Quik-Pak),…
August 2021 Quick Shots
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August 2021 Newsletter
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Industry Veteran Rosie Medina Appointed as VP of Sales and Marketing for Promex Industries, Inc. Divisions
Medina to lead sales and marketing activities for the company’s Promex Medical and Biotech and QP Technologies Entities SANTA CLARA, Calif. – July 20, 2021 – Promex Industries, a biotech microelectronics manufacturer specializing in heterogeneous integration of key subsystems for medical, diagnostic, and life sciences devices, announced that industry veteran and…
July 2021 Quick Shots
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July 2021 Newsletter
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Rethinking “Business as Usual”
By Rosie Medina, Vice President, Sales and Marketing Few things can snap your priorities into focus like the onset of a pandemic. Our industry is known for its cyclical nature, so adapting to change is not a new concept. But dealing with the challenges posed by COVID-19 has been like…
QP Technologies™ Expands Interposer Design Capabilities
Leverages Substrate Design Services to Create Flexible, Low-Cost Packaging Solutions ESCONDIDO, Calif. – March 29, 2021 – QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced expanded capabilities related to interposer designs for flip-chip and large-cavity packaging as an extension of the company’s substrate design services announced last year.…
Quik-Pak Becomes QP Technologies™
New brand reflects growing breadth of company’s technology and engineering capabilities ESCONDIDO, Calif., March 11, 2021 (GLOBE NEWSWIRE) -- Leading provider of microelectronic packaging and assembly solutions Quik-Pak today announced the business’s new name QP Technologies™. This change and the related rebranding are a natural outgrowth of the company’s evolution, including…