News & Blog


Managing MIL-STD-883 IC Compliance

The military-aerospace market has stringent requirements for parts designed into air, spacecraft, and associated systems. Proven IC and board packaging approaches are essential for enabling system designers to use commercially developed components in military and aerospace applications. MIL-STD-883 is the military testing standard that determines uniform procedures and methodologies for…

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Aluminum Wire Bonding Key for Power Electronics

A few months ago, we announced that we had expanded our wire bonding offerings by adding two bonders from Hesse Mechatronics to our manufacturing line. The systems – a Bondjet BJ855 fine wire wedge bonder and a Bondjet BJ939 heavy wire wedge bonder – deliver industry-leading bonding speed and large…

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iMAPS 2021 Recap – A Great Show

Earlier this month, we were excited to be live onsite at iMAPS 2021 in San Diego, just down the freeway from our manufacturing facility in Escondido. It was great to meet with and talk to attendees in person, chatting with folks in our booth and getting a chance to talk…

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