News & Blog


Aluminum Wire Bonding Key for Power Electronics

A few months ago, we announced that we had expanded our wire bonding offerings by adding two bonders from Hesse Mechatronics to our manufacturing line. The systems – a Bondjet BJ855 fine wire wedge bonder and a Bondjet BJ939 heavy wire wedge bonder – deliver industry-leading bonding speed and large…

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iMAPS 2021 Recap – A Great Show

Earlier this month, we were excited to be live onsite at iMAPS 2021 in San Diego, just down the freeway from our manufacturing facility in Escondido. It was great to meet with and talk to attendees in person, chatting with folks in our booth and getting a chance to talk…

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3dInCites Podcast: A Conversation about Reshoring Advanced Packaging in the US

The acronyms involving funding for semiconductor manufacturing are flying around Washington. There is the Chips for America Act, focused on re-shoring, The Facilitating American-Built Semiconductors (FABS) Act that promises tax credits for investments in, either equipment or fabs. and then there’s the $250 billion US Innovation and Competition Act, which…

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