SANTA CLARA, CA, APRIL 1 2015: Promex Industries, announced today the acquisition of San Diego based Quik-Pak, a division of Delphon. Download Press Release
San Diego, CA September 1, 2014: Quik-Pak offers packaging and assembly for high volume applications.
San Diego, CA April 30, 2014: Quik-Pak, a leader in integrated circuit (IC) packaging, wafer processing, and advanced assembly services, announced that Casey Krawiec has been promoted to global sales and marketing director. Download Press Release
Quik-Pak Selected to Provide Enhanced Molding and Assembly Services to Wireless Semiconductor and Solar Customers
San Diego, CA April 10, 2014: Quik-Pak, a leader in integrated circuit (IC) packaging, wafer processing, and advanced assembly services, has expanded its transfer molding and assembly capabilities to accommodate the increased demands of innovative companies in the wireless electronics and solar industries. Download Press Release
Hayward, CA April 4, 2014: Quik-Pak understands that the package is an integral part of the design process. Occasionally, the need arises for a specific footprint or lead count and a custom tooled package is the best option. That is why Quik-Pak offers custom molded QFN packages. These QFN packages can…
San Diego, CA, July 1, 2013: For design engineers that are required to validate the performance of their devices as quickly as possible, Quik-Pak’s OmPP packages(Open-molded Plastic Packages) provide a cost effective solution.
San Diego, CA, May 1, 2013: Quik-Pak understands that today’s smaller, lighter technologies demand that you conserve real estate on the printed circuit board and simplify the board assembly process.
San Diego, CA, April 1, 2013: Quik-Pak is a leading provider of Flip Chip Assembly Services for microelectronic device applications requiring a small footprint and short interconnects. Assembly applications include µBGA, 3D packaging, optoelectronic bonding and assembly, sensors, chip on glass, and more.
San Diego, CA, March 1, 2013: Quik-Pak can receive your wafer in the morning and ship completely assembled packages by the end of the day!
San Diego, CA, September 18, 2012: Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, announces its 8-Lead SOIC (Small Outline Integrated Circuit), the newest addition to the Open-molded Plastic Package (OmPP)® product line. Download Press Release
San Diego, CA, December 15, 2011: Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, announced today they fully support copper wire bonding with their K&S Maxum Ultra wire bonder. Download Press Release
San Diego, CA, December 14, 2011: Casey Krawiec, Global Sales and Marketing Manager for Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, presented on Aerospace and Defense Day, November 2nd, at the TowerJazz Global Symposium. The title of his presentation was, "Enabling Innovation". Download Presentation