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SANTA CLARA, CA – JUNE 30, 2016: Microelectronics Services Providers to Promote Capabilities Designed to Accelerate Time to Market at MEPTEC Medical Electronics Symposium in Portland, OR, September 14-15, 2016 Download Press Release

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SAN DIEGO, CA – MAY 23, 2016: Quik-Pak will showcase its Open-molded Plastic Packages (OmPP) for microwave and RF applications in Booth 2229 at the International Microwave Symposium (IMS), May 22-27 in San Francisco, California. Download Press Release

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SANTA CLARA, CA – FEBRUARY 9, 2016: Promex Industries Inc., a provider of engineering and mixed technology contract electronic manufacturing services, will demonstrate how it fast tracks medical and bioscience products from concept to production in Booth 480 at the Medical Device and Manufacturing West Expo, February 9-11 in Anaheim, Calif. Download Press…

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SAN DIEGO, CA, JANUARY 27, 2016: Quik-Pak, a quick-turn prototype specialist for medical devices, is co-exhibiting with its parent company Promex Industries Inc., an electronic manufacturing services (EMS) provider that integrates conventional SMT with semiconductor microelectronic packaging and assembly. Download Press Release

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SANTA CLARA, CA, APRIL 1 2015: Promex Industries, announced today the acquisition of San Diego based Quik-Pak, a division of Delphon. Download Press Release

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San Diego, CA September 1, 2014: Quik-Pak offers packaging and assembly for high volume applications.

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San Diego, CA April 30, 2014: Quik-Pak, a leader in integrated circuit (IC) packaging, wafer processing, and advanced assembly services, announced that Casey Krawiec has been promoted to global sales and marketing director. Download Press Release

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San Diego, CA April 10, 2014: Quik-Pak, a leader in integrated circuit (IC) packaging, wafer processing, and advanced assembly services, has expanded its transfer molding and assembly capabilities to accommodate the increased demands of innovative companies in the wireless electronics and solar industries. Download Press Release

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Hayward, CA April 4, 2014: Quik-Pak understands that the package is an integral part of the design process. Occasionally, the need arises for a specific footprint or lead count and a custom tooled package is the best option. That is why Quik-Pak offers custom molded QFN packages. These QFN packages can…

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San Diego, CA, July 1, 2013: For design engineers that are required to validate the performance of their devices as quickly as possible, Quik-Pak’s OmPP packages(Open-molded Plastic Packages) provide a cost effective solution.

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San Diego, CA, May 1, 2013: Quik-Pak understands that today’s smaller, lighter technologies demand that you conserve real estate on the printed circuit board and simplify the board assembly process.

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San Diego, CA, April 1, 2013: Quik-Pak is a leading provider of Flip Chip Assembly Services for microelectronic device applications requiring a small footprint and short interconnects. Assembly applications include µBGA, 3D packaging, optoelectronic bonding and assembly, sensors, chip on glass, and more.

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