Promex Showcases Heterogenous Assembly Services for Complex Devices, Quik-Pak Features Advanced Packages, in Booth 215 at ECTC, May 30-June 2, Lake Buena Vista, FL

SANTA CLARA, CA - MAY 2, 2017: Promex will showcase its heterogenous assembly services for complex medical and biotech devices, and its Quik-Pak Division will exhibit Open-molded Plastic Packages (OmPP) and air cavity QFN (Quad Flat No-Lead) Packages in Booth 215 at The Electronic Components and Technology Conference (ECTC) in…

Learn More

Quik-Pak Wins IMAPS 2016 Corporate Recognition Award for Significant Technical Contributions to the Microelectronics Industry

SAN DIEGO, CA – SEPTEMBER 11, 2016: Quik-Pak, a provider of microelectronic chip packaging and assembly solutions, will receive the International Microelectronics Assembly and Packaging Society (IMAPS) 2016 Corporate Recognition Award at the industry organization’s 49th International Symposium on Microelectronics on October 11, 2016 in Pasadena, Calif. Download Press Release

Learn More

Product Spotlight: Custom Open-molded QFN Packages (OmPP)

Hayward, CA April 4, 2014: Quik-Pak understands that the package is an integral part of the design process. Occasionally, the need arises for a specific footprint or lead count and a custom tooled package is the best option. That is why Quik-Pak offers custom molded QFN packages. These QFN packages can…

Learn More