San Diego, CA – PR Newswire June 1, 2017: Quik-Pak, a provider of innovative microelectronic packaging and assembly solutions for complex devices, will exhibit Air Cavity Plastic QFN Packages and Overmolded QFN Packages in Booth 732 at the IEEE MTT International Microwave Symposium (IMS), June 4-9, 2017 in Honolulu, HI.