SANTA CLARA, CA – MAY 2, 2017: Promex will showcase its heterogenous assembly services for complex medical and biotech devices, and its Quik-Pak Division will exhibit Open-molded Plastic Packages (OmPP) and air cavity QFN (Quad Flat No-Lead) Packages in Booth 215 at The Electronic Components and Technology Conference (ECTC) in Lake Buena Vista, Florida, May 30 – June 2, 2017.