OmPP

QP Technologies’ (formerly Quik-Pak) exclusive Open-molded Plastic Package (OmPP) is a pre-molded, air cavity QFN package (Quad Flat No-Lead) designed to provide a high quality, fast solution for your IC packaging and IC assembly needs. 

These custom QFN packages or Open-molded Plastic Packages (OmPP) come in a variety of sizes and are ideal for prototype, mid volume or production volume applications. Ceramic and plastic lids are available and are optional. 

Pre-Molded Air Cavity QFN Package Advantages:

• RoHS and REACH Compliant “Green” Molding Compound used to make QFN packages
• Gold Plated QFN Packages
• Superior Bondability
• Custom QFN Body Sizes and Lead Counts available off the shelf
• Perfect solution for rapid prototyping or volume applications
• Proven to work with RF silicon requiring frequencies of 40+Ghz

QP Technologies’ Au/Ni plated custom Air Cavity QFN (OmPP) Packages are offered in a broad assortment of sizes from 3x3mm to 12x12mm with a variety of pitch options. They are manufactured using a RoHS and REACH compliant “green” molding compound.

QP Technologies’ OmPP packages have been tested to RF frequencies of 40+GHz and are proven to be a viable yet cheaper alternative to industry standard ceramic for most applications.