Tag: Chiplet Packaging
Enabling New Functionality in Medtech and Biotech Devices
By Dick Otte, CEO, Promex Industries Medtech and biotech devices are uniquely suited to benefit from emerging electronic capabilities – specifically, the kind of electronics design, packaging and assembly offerings that are Promex’s specialty. With that said, these markets present a variety of manufacturing challenges and demands that require heterogeneous […]
Optimizing Chiplet Packaging for Complex Applications
By Dick Otte, CEO, Promex Industries Cost and performance are the two most pressing issues in chip design and manufacturing. Chiplets are a key solution being pursued by the semiconductor industry to help mitigate these challenges. These small die with specialized functionality are designed to be combined to make up a […]