San Diego, CA, February 2, 2009: Quik-Pak, a division of Delphon Industries and leading provider of custom IC Assembly, Wafer Backgrinding and Dicing, and patented Open Cavity Package services announced the launch of its new website today. The site was developed to more effectively deliver technical information regarding the company’s increased service offering such as Flip Chip assembly and Laser Micromachining.
Contact: Steve Swendrowski
Phone: (858) 521-3601
9 A.M. EDT, February 2, 2009
HAYWARD, CA, FEBRUARY 2, 2009: Quik-Pak, a division of Delphon Industries and leading provider of custom IC Assembly, Wafer Backgrinding and Dicing, and patented Open Cavity Package services announced the launch of its new website today.The site was developed to more effectively deliver technical information regarding the company’s increased service offering such as Flip Chip assembly and Laser Micromachining. A customer resource center has also been added for real time inventory tracking. To access the new site, visit www.icproto.com. “Over the last year we’ve added more advanced assembly and wafer processing services. The new website will provide our customers with technical data and specifications of our capabilities”, says Steve Swendrowski, General Manager.
Background: Quik-Pak, specializes in advanced IC Assembly and Prototyping services for fabless semiconductor companies, enabling faster time to market for new devices. The company offers Packaging and Assembly services in 24 hours or less. Quik-Pak also offers complete Wafer & Die Preparation services, including Backgrinding, Dicing, Bumping, Pick & Place and Inspection. The company’s Advanced Assembly services meet the unique requirements for Flip Chip, Chip-on-Board (COB), Stacked Die, Multi-Chip Module (MCM), System-in-Package (SIP), Ceramic, BGA and MEMS devices. Custom Assembly services include Die Bonding, Gold Wire Ball Bonding, Encapsulation & Remolding and Marking. Quik-Pak’s Laser Micromachining capability creates vast opportunities for package customization through drilling, cutting and marking of almost any material. Quik-Pak is the ideal partner for Advanced IC Assembly and Prototyping, providing unparalleled flexibility, quality and outstanding customer service.
Company Contact: Steve Swendrowski (858)521-3601 or steves@icproto.com
Marketing Contact: Jennifer Nunes (510)576-2253 or jnunes@gelpak.com