Additional Wafer Preparation Services: Die Sorting, Inspection & Wafer Cleaning
Post-Dicing & Wafer Processing Support Services
In addition to wafer backgrinding and dicing, QP Technologies (formerly Quik-Pak) provides advanced post-dicing wafer processing services to prepare die for assembly, packaging, and shipment.
Our additional wafer preparation services include:
- Automated die sort / pick & place
- 100% die inspection
- Wafer washing and cleaning
These services ensure die integrity, yield protection, and readiness for high-reliability assembly.
Automated Die Sort & Pick and Place
Following wafer dicing, QP Technologies can selectively assemble specific die and package remaining die according to your program requirements.
Using electronic wafer maps from probing or ink-dot recognition, our automated pick and place system sorts die into:
- Gel-Paks
- Waffle packs
- Chip trays
- Or leaves die on tape for future assembly
High-Mix & Multi-Project Wafer Expertise
Our automated system is specifically designed for high-mix die sorting, including:
- Multi-project wafers (MPW)
- Pizza mask wafers
- Reticle mask wafers
- Shuttle-run wafers
- Multi-chip wafers
Unlike traditional die sorters that step a fixed X-Y pitch, our flexible wafer mapping system accommodates wafers containing multiple die sizes and geometries on a single substrate.
This capability enables:
- Rapid adaptation to legacy and current wafer map formats
- Complex binning strategies
- Isolation of specific die types
- Yield optimization across mixed-device wafers
Ultra-Thin & Fragile Die Handling
Sorting ultra-thin die requires precise mechanical control.
Our pick and place system features:
- Micron-resolution die eject mechanisms
- Optimized die eject head design
- Controlled die plunge parameters
- Tape-based die removal without mechanical damage
We can safely handle die as thin as 50 microns, including fragile materials such as:
- Gallium Arsenide (GaAs)
- III-V compound semiconductors
- Other delicate substrate materials
This precision reduces chipping and preserves die integrity prior to assembly.
100% Die Inspection Services
QP Technologies provides detailed die inspection services performed by trained and certified inspectors.
Inspection capabilities include:
- Visual inspection to customer specifications
- Certification to commercial standards
- MIL-STD-883 compliant inspection
- Custom inspection criteria development
- 100% die screening when required
By isolating rejects prior to assembly, we help improve downstream assembly yield and reduce rework risk.
Wafer Washing & Cleaning Services
Wafer cleaning is a critical process step throughout semiconductor fabrication and packaging.
As device geometries shrink and new materials are introduced, cleaning requirements become increasingly complex. Each fabrication and packaging stage demands different selectivity and defect control parameters.
QP Technologies provides wafer washing and cleaning services designed to:
- Remove debris from dicing operations
- Eliminate particulates and residues
- Protect fragile device structures
- Preserve surface integrity
- Prepare wafers and die for packaging and assembly
Our cleaning processes are configured to meet the selectivity and defectivity requirements of advanced semiconductor devices while minimizing mechanical or chemical damage.
Integration with Assembly & Packaging Services
These additional wafer preparation services integrate seamlessly with QP Technologies’ broader semiconductor packaging and microelectronics assembly capabilities.
By combining sorting, inspection, and cleaning with thinning and dicing, we provide:
- Reduced handling risk
- Improved traceability
- Higher assembly yields
- Streamlined process flow
Request Post-Dicing Service Consultation
To discuss die sorting, inspection requirements, or wafer cleaning specifications, contact QP Technologies with your wafer map format, material type, and inspection criteria.