System In Packaging
QP Technologies’ (formerly Quik-Pak) flexible assembly processes can accommodate the bonding of multiple components, including die and discretes, on a single substrate.
Our System-in-Package (SiP) solutions combine multiple integrated circuits, passive components, and other devices into a single compact package, enabling complete system functionality in a highly miniaturized form factor. Leveraging expertise in advanced substrates, die stacking, wire bonding, flip-chip, and embedded passive integration, we deliver high-density designs that optimize performance, reduce footprint, and simplify assembly. Our in-house engineering team provides design-for-manufacturability reviews, signal integrity and thermal simulations, and collaborative support from concept through production. Serving applications in aerospace, defense, medical devices, telecommunications, automotive, and industrial electronics, we maintain ISO 9001:2015, ISO 13485:2016, ANSI/ESD S20.20-2021, ITAR, and RoHS compliance. Whether your project demands space savings, improved signal integrity, or faster time-to-market, our SiP solutions deliver the innovation and quality you need.