Multi Chip Module
QP Technologies’ (formerly Quik-Pak) flexible assembly processes can accommodate the bonding of multiple components, including die and discretes, on a single substrate.
Our Multi-Chip Module (MCM) solutions integrate multiple integrated circuits into a single, compact package to deliver higher performance, reduced size, and improved reliability. With capabilities in ceramic, organic, precision die attach methods, and advanced wire bonding and flip-chip assembly, we support a wide range of chip types including ASIC, memory, RF, and power devices. Our in-house engineering team provides design-for-manufacturability reviews, signal integrity and thermal simulations, and collaborative support from concept through production. Serving industries from aerospace and defense to medical, telecom, and automotive, we meet the highest standards with ISO 9001:2015, ISO 13485:2016, ANSI/ESD S20.20-2021, ITAR, and RoHS compliance. Whether your goal is miniaturization, performance enhancement, or ruggedized designs, we deliver MCM solutions that accelerate time-to-market while meeting mission-critical demands.