The International Microelectronics Assembly and Packaging Society (IMAPS) will host an Advanced Technical Workshop and Tabletop Exhibition on Wire Bonding ~ February 3-4, 2025 in San Diego, California. The objective of the Wire Bonding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and marketing people who have been working in the area of Wire Bonding.

Visit QP Technologies and learn more about our wire bonding capabilities. You can also email info@qptechnologies.com to schedule a time to meet us!