The iMAPS Florida Chapter’s Advanced Technical Workshop & Tabletops: Heterogeneous Integration – System in Package will bring together the scientists, engineers, manufacturers, academia, business, and people from around the world who work in the area of smart sensors, systems, and advanced packaging technology. This workshop and tabletop exhibits enable discussion and presentations on the latest semiconductor-based design, process, and materials for smart sensor and photonic technologies.
Get in touch with the QP team at info@qptechnologies.com to meet us at the show!