The 21st Annual Device Packaging Conference (DPC 2025) will be held in Phoenix, Arizona, on March 4-6, 2025. It is an international event organized by the International Microelectronics Assembly and Packaging Society and a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields.
Visit QP Technologies at Booth 307, where we will be exhibiting jointly with Promex Industries, to learn about our packaging capabilities. You can also email info@qptechnologies.com to schedule a time to meet us!