QP Technologies will be exhibiting at ECTC 2024, booth 638!

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.

Interested in scheduling a meeting with our packaging and assembly experts? Message us at info@qptechnologies.com to schedule time to talk with us during the conference, or stop by booth 638!