The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.

In addition to exhibiting at this years event, our CEO Dick Otte will be a part of a special panel discussion centered on Advanced Packaging Manufacturing in North America: Building the Ecosystem. This special session will be held Tuesday, May 30 3:30PM – 5:00PM. 

Interested in scheduling a meeting with our packaging and assembly experts? Message us at to schedule time to talk with us during the event!